UPD703107AF1-XXX-EN4
| Parameter Name | Attribute value |
| Brand Name | Renesas |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | LFBGA |
| package instruction | LFBGA, |
| Contacts | 161 |
| Manufacturer packaging code | PLBG0161GA-A161 |
| Reach Compliance Code | unknow |
| Has ADC | YES |
| Address bus width | 26 |
| bit size | 32 |
| DAC channel | NO |
| DMA channel | YES |
| External data bus width | 16 |
| JESD-30 code | S-PBGA-B161 |
| JESD-609 code | e0 |
| length | 13 mm |
| Number of I/O lines | 115 |
| Number of terminals | 161 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| ROM programmability | MROM |
| Maximum seat height | 1.58 mm |
| speed | 50 MHz |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | MOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 13 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
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