8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | DIP |
package instruction | DIP, DIP28,.6 |
Contacts | 28 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 30 ns |
Other features | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e0 |
length | 36.83 mm |
memory density | 65536 bi |
Memory IC Type | NON-VOLATILE SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.572 mm |
Maximum standby current | 0.003 A |
Maximum slew rate | 0.085 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 15.24 mm |
STK12C68-W30 | STK12C68-P30I | STK12C68-W30I | STK12C68-C30I | STK12C68-S30 | STK12C68-S30I | STK12C68-C30 | |
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Description | 8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | 8KX8 NON-VOLATILE SRAM, 30ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8KX8 NON-VOLATILE SRAM, 30ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | 8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, PLASTIC, SOIC-28 | 8KX8 NON-VOLATILE SRAM, 30ns, PDSO28, PLASTIC, SOIC-28 | 8KX8 NON-VOLATILE SRAM, 30ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | DIP | DIP | DIP | DIP | SOIC | SOIC | DIP |
package instruction | DIP, DIP28,.6 | DIP, DIP28,.3 | DIP, DIP28,.6 | DIP, DIP28,.3 | SOP, SOP28,.5 | SOP, SOP28,.5 | DIP, DIP28,.3 |
Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns |
Other features | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES | EEPROM HARDWARE/SOFTWARE STORE; SOFTWARE RECALL; RETENTION/ENDURANCE = 10 YEARS/100000 CYCLES |
JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-CDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-CDIP-T28 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 36.83 mm | 34.67 mm | 36.83 mm | 35.56 mm | 18.0848 mm | 18.0848 mm | 35.56 mm |
memory density | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
Memory IC Type | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | DIP | SOP | SOP | DIP |
Encapsulate equivalent code | DIP28,.6 | DIP28,.3 | DIP28,.6 | DIP28,.3 | SOP28,.5 | SOP28,.5 | DIP28,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.572 mm | 4.572 mm | 4.572 mm | 4.2418 mm | 2.54 mm | 2.54 mm | 4.2418 mm |
Maximum standby current | 0.003 A | 0.003 A | 0.003 A | 0.002 A | 0.003 A | 0.003 A | 0.002 A |
Maximum slew rate | 0.085 mA | 0.095 mA | 0.095 mA | 0.095 mA | 0.085 mA | 0.095 mA | 0.085 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
width | 15.24 mm | 7.62 mm | 15.24 mm | 7.62 mm | 8.763 mm | 8.763 mm | 7.62 mm |
Maker | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
Humidity sensitivity level | - | - | - | 3 | 3 | 3 | 3 |