AT27LV040A-12TI datasheet, PDF

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AT27LV040A-12TI: Description4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM; Categorystorage storage; File Size160KB，9 Pages; ManufacturerAtmel (Microchip)

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AT27LV040A-12TI Overview

4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM

AT27LV040A-12TI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
Parts packaging code	TSOP1
package instruction	TSOP1, TSSOP32,.8,20
Contacts	32
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	120 ns
Other features	CAN ALSO OPERATE WITH 5V SUPPLY
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	18.4 mm
memory density	4194304 bi
Memory IC Type	OTP ROM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP32,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	3.3/5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00002 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	8 mm

AT27LV040A-12TI Related Products

	AT27LV040A-12TI	AT27LV040A	AT27LV040A-12JC	AT27LV040A-12TC	AT27LV040A-15	AT27LV040A-12	AT27LV040A-12JI	AT27LV040A-15JI	AT27LV040A-15TC	AT27LV040A-15TI
Description	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM	4 Megabit 512K x 8 Low Voltage OTP CMOS EPROM
Is it Rohs certified?	incompatible	-	incompatible	incompatible	-	-	incompatible	incompatible	incompatible	incompatible
Maker	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)	-	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	TSOP1	-	QFJ	TSOP1	-	-	QFJ	QFJ	TSOP1	TSOP1
package instruction	TSOP1, TSSOP32,.8,20	-	QCCJ, LDCC32,.5X.6	TSOP1, TSSOP32,.8,20	-	-	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20
Contacts	32	-	32	32	-	-	32	32	32	32
Reach Compliance Code	compli	-	compli	compli	-	-	compli	unknow	compli	compli
ECCN code	EAR99	-	EAR99	EAR99	-	-	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	-	120 ns	120 ns	-	-	120 ns	150 ns	150 ns	150 ns
Other features	CAN ALSO OPERATE WITH 5V SUPPLY	-	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	-	-	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY	CAN ALSO OPERATE WITH 5V SUPPLY
I/O type	COMMON	-	COMMON	COMMON	-	-	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G32	-	R-PQCC-J32	R-PDSO-G32	-	-	R-PQCC-J32	R-PQCC-J32	R-PDSO-G32	R-PDSO-G32
JESD-609 code	e0	-	e0	e0	-	-	e0	e0	e0	e0
length	18.4 mm	-	13.97 mm	18.4 mm	-	-	13.97 mm	13.97 mm	18.4 mm	18.4 mm
memory density	4194304 bi	-	4194304 bi	4194304 bi	-	-	4194304 bi	4194304 bi	4194304 bi	4194304 bi
Memory IC Type	OTP ROM	-	OTP ROM	OTP ROM	-	-	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	-	8	8	-	-	8	8	8	8
Humidity sensitivity level	3	-	2	3	-	-	2	2	3	3
Number of functions	1	-	1	1	-	-	1	1	1	1
Number of terminals	32	-	32	32	-	-	32	32	32	32
word count	524288 words	-	524288 words	524288 words	-	-	524288 words	524288 words	524288 words	524288 words
character code	512000	-	512000	512000	-	-	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	-	70 °C	70 °C	-	-	85 °C	85 °C	70 °C	85 °C
organize	512KX8	-	512KX8	512KX8	-	-	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	-	3-STATE	3-STATE	-	-	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	-	QCCJ	TSOP1	-	-	QCCJ	QCCJ	TSOP1	TSOP1
Encapsulate equivalent code	TSSOP32,.8,20	-	LDCC32,.5X.6	TSSOP32,.8,20	-	-	LDCC32,.5X.6	LDCC32,.5X.6	TSSOP32,.8,20	TSSOP32,.8,20
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	-	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE	-	-	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	-	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	-	225	240	-	-	225	225	240	240
power supply	3.3/5 V	-	3.3/5 V	3.3/5 V	-	-	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	-	3.55 mm	1.2 mm	-	-	3.55 mm	3.55 mm	1.2 mm	1.2 mm
Maximum standby current	0.00002 A	-	0.00002 A	0.00002 A	-	-	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Maximum slew rate	0.03 mA	-	0.03 mA	0.03 mA	-	-	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	-	-	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	-	3 V	3 V	-	-	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	-	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	-	-	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	-	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	COMMERCIAL	-	-	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	-	J BEND	GULL WING	-	-	J BEND	J BEND	GULL WING	GULL WING
Terminal pitch	0.5 mm	-	1.27 mm	0.5 mm	-	-	1.27 mm	1.27 mm	0.5 mm	0.5 mm
Terminal location	DUAL	-	QUAD	DUAL	-	-	QUAD	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	30	30	-	-	30	30	30	30
width	8 mm	-	11.43 mm	8 mm	-	-	11.43 mm	11.43 mm	8 mm	8 mm

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