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S34MS02G100BHI013

Description
Flash, 256MX8, PBGA63, BGA-63
Categorystorage    storage   
File Size3MB,75 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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S34MS02G100BHI013 Overview

Flash, 256MX8, PBGA63, BGA-63

S34MS02G100BHI013 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
package instructionBGA-63
Reach Compliance Codeunknow
JESD-30 codeR-PBGA-B63
length11 mm
memory density2147483648 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals63
word count268435456 words
character code256000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256MX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage1.8 V
Maximum seat height1 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
typeSLC NAND TYPE
width9 mm
Spansion
®
SLC NAND Flash Memory for
Embedded
1 Gb, 2 Gb, 4 Gb Densities:
1-bit ECC, x8 and x16 I/O, 1.8V V
CC
S34MS01G1, S34MS02G1, S34MS04G1
Spansion
®
SLC NAND Flash Memory for Embedded Cover Sheet
Data Sheet
(Preliminary)
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S34MS01G1_04G1
Revision
06
Issue Date
August 9, 2013

S34MS02G100BHI013 Related Products

S34MS02G100BHI013 S34MS02G100BHI010 S34MS02G100TFI010 S34MS02G100TFI013 S34MS01G100TFI010 S34MS01G100TFI013
Description Flash, 256MX8, PBGA63, BGA-63 Flash, 256MX8, PBGA63, BGA-63 Flash, 256MX8, PDSO48, TSOP1-48 Flash, 256MX8, PDSO48, TSOP1-48 Flash, 128MX8, PDSO48, TSOP1-48 Flash, 128MX8, PDSO48, TSOP1-48
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION
package instruction BGA-63 BGA-63 TSOP1-48 TSOP1, TSOP1-48 TSOP1,
Reach Compliance Code unknow unknow unknow unknow unknow unknow
JESD-30 code R-PBGA-B63 R-PBGA-B63 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
length 11 mm 11 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 2147483648 bi 2147483648 bi 2147483648 bi 2147483648 bi 1073741824 bi 1073741824 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 63 63 48 48 48 48
word count 268435456 words 268435456 words 268435456 words 268435456 words 134217728 words 134217728 words
character code 256000000 256000000 256000000 256000000 128000000 128000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 256MX8 256MX8 256MX8 256MX8 128MX8 128MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA TSOP1 TSOP1 TSOP1 TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Maximum seat height 1 mm 1 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM DUAL DUAL DUAL DUAL
type SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE
width 9 mm 9 mm 12 mm 12 mm 12 mm 12 mm

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