Flash, 512KX16, 70ns, PBGA45, 4.26 X 2.04 MM, LEAD FREE, WLCSP-45
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | VFBGA, BGA45,9X11,16/8 |
Contacts | 45 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 70 ns |
Other features | TOP BOOT BLOCK |
Spare memory width | 8 |
startup block | TOP |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B45 |
length | 4.26 mm |
memory density | 8388608 bi |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of departments/size | 8,15 |
Number of terminals | 45 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA45,9X11,16/8 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
power supply | 1.8 V |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 0.6 mm |
Department size | 8K,64K |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.4 mm |
Terminal location | BOTTOM |
switch bit | YES |
type | NOR TYPE |
width | 2.04 mm |
S29AS008J70LFI012 | S29AS008J70LFI022 | S29AS008J70TFI010 | S29AS008J70LFI013 | S29AS008J70LFI023 | S29AS008J70TFI020 | S29AS008J70TFI013 | S29AS008J70TFI023 | |
---|---|---|---|---|---|---|---|---|
Description | Flash, 512KX16, 70ns, PBGA45, 4.26 X 2.04 MM, LEAD FREE, WLCSP-45 | Flash, 512KX16, 70ns, PBGA45, 4.26 X 2.04 MM, LEAD FREE, WLCSP-45 | Flash, 512KX16, 70ns, PDSO48, LEAD FREE, MO-142DDD, TSOP-48 | Flash, 512KX16, 70ns, PBGA45, 4.26 X 2.04 MM, LEAD FREE, WLCSP-45 | Flash, 512KX16, 70ns, PBGA45, 4.26 X 2.04 MM, LEAD FREE, WLCSP-45 | Flash, 512KX16, 70ns, PDSO48, LEAD FREE, MO-142DDD, TSOP-48 | Flash, 512KX16, 70ns, PDSO48, LEAD FREE, MO-142DDD, TSOP-48 | Flash, 512KX16, 70ns, PDSO48, LEAD FREE, MO-142DDD, TSOP-48 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | BGA | BGA | TSOP1 | BGA | BGA | TSOP1 | TSOP1 | TSOP1 |
package instruction | VFBGA, BGA45,9X11,16/8 | 4.26 X 2.04 MM, LEAD FREE, WLCSP-45 | LEAD FREE, MO-142DDD, TSOP-48 | VFBGA, BGA45,9X11,16/8 | VFBGA, BGA45,9X11,16/8 | LEAD FREE, MO-142DDD, TSOP-48 | LEAD FREE, MO-142DDD, TSOP-48 | LEAD FREE, MO-142DDD, TSOP-48 |
Contacts | 45 | 45 | 48 | 45 | 45 | 48 | 48 | 48 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknow | unknow | unknow | unknow |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
Other features | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | TOP BOOT BLOCK | TOP BOOT BLOCK | BOTTOM BOOT BLOCK | BOTTOM BOOT BLOCK | TOP BOOT BLOCK | BOTTOM BOOT BLOCK |
Spare memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
startup block | TOP | BOTTOM | TOP | TOP | BOTTOM | BOTTOM | TOP | BOTTOM |
command user interface | YES | YES | YES | YES | YES | YES | YES | YES |
Universal Flash Interface | YES | YES | YES | YES | YES | YES | YES | YES |
Data polling | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 code | R-PBGA-B45 | R-PBGA-B45 | R-PDSO-G48 | R-PBGA-B45 | R-PBGA-B45 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
length | 4.26 mm | 4.26 mm | 18.4 mm | 4.26 mm | 4.26 mm | 18.4 mm | 18.4 mm | 18.4 mm |
memory density | 8388608 bi | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi |
Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of departments/size | 8,15 | 8,15 | 8,15 | 8,15 | 8,15 | 8,15 | 8,15 | 8,15 |
Number of terminals | 45 | 45 | 48 | 45 | 45 | 48 | 48 | 48 |
word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | VFBGA | VFBGA | TSOP1 | VFBGA | VFBGA | TSOP1 | TSOP1 | TSOP1 |
Encapsulate equivalent code | BGA45,9X11,16/8 | BGA45,9X11,16/8 | TSSOP48,.8,20 | BGA45,9X11,16/8 | BGA45,9X11,16/8 | TSSOP48,.8,20 | TSSOP48,.8,20 | TSSOP48,.8,20 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Programming voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ready/busy | YES | YES | YES | YES | YES | YES | YES | YES |
Maximum seat height | 0.6 mm | 0.6 mm | 1.2 mm | 0.6 mm | 0.6 mm | 1.2 mm | 1.2 mm | 1.2 mm |
Department size | 8K,64K | 8K,64K | 8K,64K | 8K,64K | 8K,64K | 8K,64K | 8K,64K | 8K,64K |
Maximum standby current | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A |
Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
Maximum supply voltage (Vsup) | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
Minimum supply voltage (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL | GULL WING | BALL | BALL | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.4 mm | 0.4 mm | 0.5 mm | 0.4 mm | 0.4 mm | 0.5 mm | 0.5 mm | 0.5 mm |
Terminal location | BOTTOM | BOTTOM | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | DUAL |
switch bit | YES | YES | YES | YES | YES | YES | YES | YES |
type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
width | 2.04 mm | 2.04 mm | 12 mm | 2.04 mm | 2.04 mm | 12 mm | 12 mm | 12 mm |
Maker | SPANSION | - | - | SPANSION | SPANSION | SPANSION | SPANSION | SPANSION |