HY5V56FLF-6 datasheet, PDF - EEWORLD Datasheet

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HY5V56FLF-6: DescriptionSynchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, FBGA-54; Categorystorage storage; File Size576KB，47 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY5V56FLF-6 Overview

Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, FBGA-54

HY5V56FLF-6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	BGA
package instruction	TFBGA, BGA54,9X9,32
Contacts	54
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PBGA-B54
length	10 mm
memory density	268435456 bi
Memory IC Type	SYNCHRONOUS DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	54
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA54,9X9,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.1 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.001 A
Maximum slew rate	0.18 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

HY5V56FLF-6 Related Products

	HY5V56FLF-6	HY5V56FF-H	HY5V56FFP-H	HY5V56FLFP-H	HY5V56FFP-6	HY5V56FF-6	HY5V56FLF-H	HY5V56FLFP-6
Description	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, FBGA-54	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, FBGA-54	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-54	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-54	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-54	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, FBGA-54	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, FBGA-54	Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 10 X 8 MM, 0.80 MM PITCH, LEAD FREE, FBGA-54
Is it Rohs certified?	incompatible	incompatible	conform to	conform to	conform to	incompatible	incompatible	conform to
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA54,9X9,32	TFBGA, BGA54,9X9,32	TFBGA, BGA54,9X9,32	TFBGA, BGA54,9X9,32	TFBGA, BGA54,9X9,32	TFBGA, BGA54,9X9,32	TFBGA, BGA54,9X9,32	TFBGA, BGA54,9X9,32
Contacts	54	54	54	54	54	54	54	54
Reach Compliance Code	compli	compliant	unknown	compliant	unknown	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	5.4 ns	5.4 ns	5.4 ns	5.4 ns	5.4 ns	5.4 ns	5.4 ns	5.4 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz	133 MHz	133 MHz	133 MHz	166 MHz	166 MHz	133 MHz	166 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
interleaved burst length	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
JESD-30 code	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54	R-PBGA-B54
length	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
memory density	268435456 bi	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bi	268435456 bi	268435456 bi
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	54	54	54	54	54	54	54	54
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA54,9X9,32	BGA54,9X9,32	BGA54,9X9,32	BGA54,9X9,32	BGA54,9X9,32	BGA54,9X9,32	BGA54,9X9,32	BGA54,9X9,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	260	260	260	NOT SPECIFIED	NOT SPECIFIED	260
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192	8192	8192	8192	8192	8192
Maximum seat height	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES
Continuous burst length	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP
Maximum standby current	0.001 A	0.002 A	0.002 A	0.001 A	0.002 A	0.002 A	0.001 A	0.001 A
Maximum slew rate	0.18 mA	0.17 mA	0.17 mA	0.17 mA	0.18 mA	0.18 mA	0.17 mA	0.18 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	20	20	20	NOT SPECIFIED	NOT SPECIFIED	20
width	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm

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