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1MDL06-031-05T

Description
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
File Size3MB,8 Pages
ManufacturerRMT Ltd.
Websitehttp://www.rmtltd.ru/
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1MDL06-031-05T Overview

Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

Thermoelectric Cooling Solutions
Performance Parameters
Type
1MDL06-031-03t
1MDL06-031-05t
1MDL06-031-07t
1MDL06-031-09t
1MDL06-031-12t
1MDL06-031-15t
1MDL06-031-XXt
I
max
A
5.2
3.3
2.4
1.9
1.4
1.1
ΔT
max
K
68
71
72
73
73
73
Q
max
W
11.93
7.63
5.61
4.43
3.37
2.72
U
max
V
AC R
Ohm
0.55
0.89
1.23
1.57
2.08
2.59
H
mm
0.9
1.1
1.3
1.5
1.8
2.1
1MDL06-031-xxt (N=31)
3.9
Performance data are given for 300K, vacuum
Dimensions
Manufacturing options
A. TEC Assembly:
* 1. Solder SnSb (T
melt
=230°C)
2. Solder AuSn (T
melt
=280°C)
B. Ceramics:
C. Ceramics Surface Options:
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, T
melt
=117°C)
3.2 Solder 138 (Sn-Bi, T
melt
= 138°C)
3.3 Solder 143 (In-Ag, T
melt
= 143°C)
3.4 Solder 157 (In, T
melt
= 157°C)
3.5 Solder 183 (Pb-Sn, T
melt
=183°C)
3.6 Optional (specified by Customer)
46 Warshavskoe shosse. Moscow 115230
 Russia,
ph: +7-499-678-2082, fax: +7-499-678-2083, web:
www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
D. Thermistor (optional)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
3. Insulated, color coded
*
1.Pure Al
2
O
3
(100%)
2.Alumina (Al
2
O
3
- 96%)
3.Aluminum Nitride (AlN)
* - used by default
Page 1 of 8

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