K6T2016U3M-TF850 datasheet, PDF

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K6T2016U3M-TF850: DescriptionStandard SRAM, 128KX16, 85ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44; Categorystorage storage; File Size135KB，9 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6T2016U3M-TF850 Overview

Standard SRAM, 128KX16, 85ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44

K6T2016U3M-TF850 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	TSOP2
package instruction	TSOP2,
Contacts	44
Reach Compliance Code	compli
ECCN code	3A991.B.2.A
Maximum access time	85 ns
JESD-30 code	R-PDSO-G44
length	18.41 mm
memory density	2097152 bi
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	44
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
width	10.16 mm

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K6T2016U3M Family

Document Title

128K x16 bit Low Power and Low Voltage CMOS Static RAM

CMOS SRAM

Revision History

Revision No.

0.0

0.1

History

Initial Draft

Revise

- Increased operating current(I

CC1

):20mA

→

25mA

Finalize

Draft Data

October 1, 1997

December 9, 1997

Remark

Preliminary

1.0

August 27, 1998

Final

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and

products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.

Revision 1.0

August 1998

K6T2016U3M-TF850 Related Products

	K6T2016U3M-TF850	K6T2016U3M-TB850	K6T2016U3M-TF10	K6T2016U3M-TB10	K6T2016U3M-TB100	K6T2016U3M-TB85	K6T2016U3M-TF85
Description	Standard SRAM, 128KX16, 85ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 128KX16, 85ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 128KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 128KX16, 85ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 128KX16, 85ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2
package instruction	TSOP2,	TSOP2,	TSOP2,	TSOP2,	TSOP2,	TSOP2,	TSOP2,
Contacts	44	44	44	44	44	44	44
Reach Compliance Code	compli	compliant	unknown	unknown	compliant	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	85 ns	85 ns	100 ns	100 ns	100 ns	85 ns	85 ns
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44
length	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm
memory density	2097152 bi	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1
Number of terminals	44	44	44	44	44	44	44
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C
organize	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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