32-BIT, 667MHz, RISC PROCESSOR, PBGA740, 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
Parts packaging code | BGA |
package instruction | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740 |
Contacts | 740 |
Reach Compliance Code | _compli |
ECCN code | 3A001.A.3 |
Address bus width | 32 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 66.67 MHz |
External data bus width | 32 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B740 |
JESD-609 code | e0 |
length | 37.5 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 740 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA740,37X37,40 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.8/2.5,3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.69 mm |
speed | 667 MHz |
Maximum supply voltage | 1.35 V |
Minimum supply voltage | 1.25 V |
Nominal supply voltage | 1.3 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Lead/Silver (Sn/Pb/Ag) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 37.5 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |