Standard SRAM, 1MX1, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Mitsubishi |
Parts packaging code | DIP |
package instruction | DIP, DIP28,.4 |
Contacts | 28 |
Reach Compliance Code | unknow |
ECCN code | 3A991.B.2.B |
Maximum access time | 20 ns |
Spare memory width | 4 |
I/O type | SEPARATE |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e0 |
memory density | 1048576 bi |
Memory IC Type | STANDARD SRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 28 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX1 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.4 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.001 A |
Minimum standby current | 3 V |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 3.63 V |
Minimum supply voltage (Vsup) | 2.97 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
M5M5V1001BP-20 | M5M5V1001BJ-25 | M5M5V1001BJ-25T | M5M5V1001BP-25 | M5M5V1001BJ-20 | M5M5V1001BJ-20T | M5M5V1001BJ-30 | M5M5V1001BJ-30T | M5M5V1001BP-30 | |
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Description | Standard SRAM, 1MX1, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 | Standard SRAM, 1MX1, 25ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 25ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 25ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 | Standard SRAM, 1MX1, 20ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 20ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 30ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 30ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Standard SRAM, 1MX1, 30ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 |
Parts packaging code | DIP | SOJ | SOJ | DIP | SOJ | SOJ | SOJ | SOJ | DIP |
package instruction | DIP, DIP28,.4 | SOJ, SOJ28,.44 | SOJ, | DIP, DIP28,.4 | SOJ, SOJ28,.44 | SOJ, | SOJ, SOJ28,.44 | SOJ, | DIP, DIP28,.4 |
Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
ECCN code | 3A991.B.2.B | EAR99 | EAR99 | EAR99 | 3A991.B.2.B | 3A991.B.2.B | EAR99 | EAR99 | EAR99 |
Maximum access time | 20 ns | 25 ns | 25 ns | 25 ns | 20 ns | 20 ns | 30 ns | 30 ns | 30 ns |
Spare memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
JESD-30 code | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 |
memory density | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi | 1048576 bi |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 | 1MX1 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | NO | NO | NO | NO | NO | NO | NO | NO | NO |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOJ | SOJ | DIP | SOJ | SOJ | SOJ | SOJ | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
Minimum supply voltage (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | YES | YES | NO | YES | YES | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible | - | incompatible | - | incompatible |
Maker | Mitsubishi | - | - | Mitsubishi | Mitsubishi | Mitsubishi | Mitsubishi | Mitsubishi | Mitsubishi |
I/O type | SEPARATE | SEPARATE | - | SEPARATE | SEPARATE | - | SEPARATE | - | SEPARATE |
JESD-609 code | e0 | e0 | - | e0 | e0 | - | e0 | - | e0 |
Encapsulate equivalent code | DIP28,.4 | SOJ28,.44 | - | DIP28,.4 | SOJ28,.44 | - | SOJ28,.44 | - | DIP28,.4 |
power supply | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
Maximum standby current | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | - | 0.001 A | - | 0.001 A |
Minimum standby current | 3 V | 3 V | - | 3 V | 3 V | - | 3 V | - | 3 V |
Maximum slew rate | 0.1 mA | 0.09 mA | - | 0.09 mA | 0.1 mA | - | 0.08 mA | - | 0.08 mA |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
Terminal pitch | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | - | 1.27 mm | - | 2.54 mm |