Flash, 32GX8, PBGA52, 14 X 18 MM, 1 MM HEIGHT, PLASTIC, LEAD FREE, VLGA-52
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Micron Technology |
Parts packaging code | LGA |
package instruction | 14 X 18 MM, 1 MM HEIGHT, PLASTIC, LEAD FREE, VLGA-52 |
Contacts | 52 |
Reach Compliance Code | compli |
ECCN code | 3A991.B.1.A |
JESD-30 code | R-PBGA-B52 |
length | 18 mm |
memory density | 274877906944 bi |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 52 |
word count | 34359738368 words |
character code | 32000000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32GX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFLGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Programming voltage | 2.7 V |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BUTT |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
type | MLC NAND TYPE |
width | 14 mm |