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MT18HVS25672PKIZ-80EXX

Description
DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244
Categorystorage    storage   
File Size367KB,16 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
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MT18HVS25672PKIZ-80EXX Overview

DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244

MT18HVS25672PKIZ-80EXX Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeDIMM
package instructionDIMM,
Contacts244
Reach Compliance Codecompli
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Other featuresAUTO REFRESH
JESD-30 codeR-XDMA-N244
JESD-609 codee4
length82 mm
memory density19327352832 bi
Memory IC TypeDDR DRAM
memory width72
Number of functions1
Number of ports1
Number of terminals244
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Maximum seat height3.8 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD
Terminal formNO LEAD
Terminal locationDUAL
width18.2 mm

MT18HVS25672PKIZ-80EXX Related Products

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Description DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244 DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244 DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244 DDR DRAM, 512MX72, CMOS, HALOGEN FREE, DIMM-244 DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244 DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, RDIMM-244 DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244 DDR DRAM, 512MX72, CMOS, HALOGEN FREE, DIMM-244 DDR DRAM, 256MX72, CMOS, HALOGEN FREE, DIMM-244
Parts packaging code DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
package instruction DIMM, HALOGEN FREE, DIMM-244 DIMM, DIMM, HALOGEN FREE, DIMM-244 , DIMM, DIMM, DIMM,
Contacts 244 244 244 244 244 244 244 244 244
Reach Compliance Code compli unknown compliant compliant compliant unknown compliant compliant compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Other features AUTO REFRESH AUTO REFRESH AUTO REFRESH AUTO REFRESH AUTO REFRESH AUTO/SELF REFRESH AUTO REFRESH AUTO REFRESH AUTO REFRESH
JESD-30 code R-XDMA-N244 R-XDMA-N244 R-XDMA-N244 R-XDMA-N244 R-XDMA-N244 R-XZMA-N244 R-XDMA-N244 R-XDMA-N244 R-XDMA-N244
JESD-609 code e4 e4 e4 e4 e4 e4 e4 e4 e4
length 82 mm 82 mm 82 mm 82 mm 82 mm 82 mm 82 mm 82 mm 82 mm
memory density 19327352832 bi 19327352832 bit 19327352832 bit 38654705664 bit 19327352832 bit 19327352832 bit 19327352832 bit 38654705664 bit 19327352832 bi
Memory IC Type DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM MODULE DDR DRAM DDR DRAM DDR DRAM
memory width 72 72 72 72 72 72 72 72 72
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 244 244 244 244 244 244 244 244 244
word count 268435456 words 268435456 words 268435456 words 536870912 words 268435456 words 268435456 words 268435456 words 536870912 words 268435456 words
character code 256000000 256000000 256000000 512000000 256000000 256000000 256000000 512000000 256000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - - -40 °C - - -40 °C -40 °C -40 °C
organize 256MX72 256MX72 256MX72 512MX72 256MX72 256MX72 256MX72 512MX72 256MX72
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Maximum seat height 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm 3.8 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface GOLD GOLD GOLD GOLD GOLD GOLD GOLD GOLD GOLD
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL DUAL DUAL ZIG-ZAG DUAL DUAL DUAL
width 18.2 mm 18.2 mm 18.2 mm 18.2 mm 18.2 mm 18.2 mm 18.2 mm 18.2 mm 18.2 mm
Maker Micron Technology Micron Technology - - Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
encapsulated code DIMM DIMM DIMM DIMM DIMM - DIMM DIMM DIMM
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
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