MASK ROM, 8KX8, 350ns, NMOS, PDIP24, PLASTIC, DIP-24
Parameter Name | Attribute value |
Maker | Fairchild |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 24 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 350 ns |
JESD-30 code | R-PDIP-T24 |
length | 31.75 mm |
memory density | 65536 bi |
Memory IC Type | MASK ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 4.698 mm |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | NMOS |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
F356435P | F356425P | F356425S | F356435S | |
---|---|---|---|---|
Description | MASK ROM, 8KX8, 350ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 8KX8, 250ns, NMOS, PDIP24, PLASTIC, DIP-24 | MASK ROM, 8KX8, 250ns, NMOS, CDIP24, CERAMIC, DIP-24 | MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 |
Maker | Fairchild | Fairchild | Fairchild | Fairchild |
Parts packaging code | DIP | DIP | DIP | DIP |
package instruction | DIP, | DIP, | DIP, | DIP, |
Contacts | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknow | unknown | unknown | unknow |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 350 ns | 250 ns | 250 ns | 350 ns |
JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
length | 31.75 mm | 31.75 mm | 32.0675 mm | 32.0675 mm |
memory density | 65536 bi | 65536 bit | 65536 bit | 65536 bi |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 | 24 |
word count | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DIP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 4.698 mm | 4.698 mm | 6.37 mm | 6.37 mm |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | NMOS | NMOS | NMOS | NMOS |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |