Splitter, 0MHz Min, 20000MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Thin Film Technology Corp (TFT) |
Reach Compliance Code | compli |
Characteristic impedance | 50 Ω |
structure | COMPONENT |
JESD-609 code | e3 |
Maximum operating frequency | 20000 MHz |
Minimum operating frequency | |
RF/Microwave Device Types | SPLITTER |
Terminal surface | Matte Tin (Sn) - with Nickel (Ni) barrie |
Maximum voltage standing wave ratio | 1.5 |
PS1608GT2R50T1-LF | PS2012GT2R50T5-LF | PS5025GT2R50T1-LF | PS5025GT2R50T5-LF | PS3216GT2R50T1-LF | PS2012GT2R50T1-LF | PS3216GT2R50T5-LF | PS1608GT2R50T5-LF | |
---|---|---|---|---|---|---|---|---|
Description | Splitter, 0MHz Min, 20000MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 | Splitter, 0MHz Min, 17500MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 | Splitter, 0MHz Min, 10000MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 | Splitter, 0MHz Min, 10000MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 | Splitter, 0MHz Min, 15000MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 | Splitter, 0MHz Min, 17500MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 | Splitter, 0MHz Min, 15000MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 | Splitter, 0MHz Min, 20000MHz Max, ROHS COMPLIANT, SURFACE MOUNT PACKAGE-3 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Characteristic impedance | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
structure | COMPONENT | COMPONENT | COMPONENT | COMPONENT | COMPONENT | COMPONENT | COMPONENT | COMPONENT |
Maximum operating frequency | 20000 MHz | 17500 MHz | 10000 MHz | 10000 MHz | 15000 MHz | 17500 MHz | 15000 MHz | 20000 MHz |
RF/Microwave Device Types | SPLITTER | SPLITTER | SPLITTER | SPLITTER | SPLITTER | SPLITTER | SPLITTER | SPLITTER |
Maximum voltage standing wave ratio | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
Maker | Thin Film Technology Corp (TFT) | - | - | - | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) |
JESD-609 code | e3 | - | e3 | e3 | e3 | - | e3 | e3 |
Terminal surface | Matte Tin (Sn) - with Nickel (Ni) barrie | - | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier | - | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier |