8K X 8 SPI BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 8 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 1 MHz |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e3 |
length | 9.46 mm |
memory density | 65536 bi |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 8192 words |
character code | 8000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 4.32 mm |
Serial bus type | SPI |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 1.8 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Maximum write cycle time (tWC) | 5 ms |
Base Number Matches | 1 |