BOARD-66, Box
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | BOARD |
| package instruction | PGA, PGA66,11X11 |
| Contacts | 66 |
| Manufacturer packaging code | HC66 |
| Reach Compliance Code | _compli |
| Maximum access time | 25 ns |
| I/O type | COMMON |
| JESD-30 code | S-XPGA-P66 |
| JESD-609 code | e0 |
| memory density | 4194304 bi |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Humidity sensitivity level | 1 |
| Number of terminals | 66 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 128KX32 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA66,11X11 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Maximum standby current | 0.08 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.8 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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