Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00024uF, Surface Mount, 0606, CHIP
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | AVX |
package instruction | , 0606 |
Reach Compliance Code | _compli |
ECCN code | EAR99 |
capacitance | 0.00024 µF |
Capacitor type | CERAMIC CAPACITOR |
dielectric materials | CERAMIC |
high | 0.979 mm |
JESD-609 code | e0 |
length | 1.4 mm |
Installation features | SURFACE MOUNT |
multi-layer | Yes |
negative tolerance | 2% |
Number of terminals | 2 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package shape | RECTANGULAR PACKAGE |
Package form | SMT |
method of packing | WAFFLE PACK |
positive tolerance | 2% |
Rated (DC) voltage (URdc) | 50 V |
Guideline | MIL-PRF-55681 |
size code | 0606 |
surface mount | YES |
Temperature characteristic code | BP |
Temperature Coefficient | 30ppm/Cel ppm/°C |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal shape | WRAPAROUND |
width | 1.4 mm |
CDR12BP241AGUM | CDR12BP511AGUM | CDR12BP821AGUM | CDR12BP331AGUM | CDR12BP121AFUR | CDR12BP221AFWP | CDR12BP821AFWP | CDR14BP112AGUM | CDR14BP272AGUM | |
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Description | Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00024uF, Surface Mount, 0606, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00051uF, Surface Mount, 0606, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00082uF, Surface Mount, 0606, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00033uF, Surface Mount, 0606, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00012uF, Surface Mount, 0606, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00022uF, Surface Mount, 0606, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00082uF, Surface Mount, 0606, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.0011uF, Surface Mount, 1111, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.0027uF, Surface Mount, 1111, CHIP |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | AVX | AVX | AVX | AVX | AVX | AVX | AVX | AVX | AVX |
package instruction | , 0606 | , 0606 | , 0606 | , 0606 | , 0606 | , 0606 | , 0606 | , 1111 | , 1111 |
Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | compliant | compliant | not_compliant | not_compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
capacitance | 0.00024 µF | 0.00051 µF | 0.00082 µF | 0.00033 µF | 0.00012 µF | 0.00022 µF | 0.00082 µF | 0.0011 µF | 0.0027 µF |
Capacitor type | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
dielectric materials | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
high | 0.979 mm | 0.979 mm | 0.979 mm | 0.979 mm | 0.979 mm | 0.979 mm | 0.979 mm | 1.676 mm | 1.676 mm |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 2.79 mm | 2.79 mm |
Installation features | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
multi-layer | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
negative tolerance | 2% | 2% | 2% | 2% | 1% | 1% | 1% | 2% | 2% |
Number of terminals | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package shape | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
Package form | SMT | SMT | SMT | SMT | SMT | SMT | SMT | SMT | SMT |
method of packing | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK | WAFFLE PACK |
positive tolerance | 2% | 2% | 2% | 2% | 1% | 1% | 1% | 2% | 2% |
Rated (DC) voltage (URdc) | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
Guideline | MIL-PRF-55681 | MIL-PRF-55681 | MIL-PRF-55681 | MIL-PRF-55681 | MIL-PRF-55681 | MIL-PRF-55681 | MIL-PRF-55681 | MIL-PRF-55681 | MIL-PRF-55681 |
size code | 0606 | 0606 | 0606 | 0606 | 0606 | 0606 | 0606 | 1111 | 1111 |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Temperature characteristic code | BP | BP | BP | BP | BP | BP | BP | BP | BP |
Temperature Coefficient | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal shape | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
width | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 2.79 mm | 2.79 mm |
Factory Lead Time | - | 28 weeks | - | 9 weeks | 28 weeks | 9 weeks | 9 weeks | - | - |