EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

AR0402FR-071M27

Description
Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 1270000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size335KB,9 Pages
ManufacturerYAGEO
Websitehttp://www.yageo.com/
Environmental Compliance  
Download Datasheet Parametric View All

AR0402FR-071M27 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 1270000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP, ROHS COMPLIANT

AR0402FR-071M27 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerYAGEO
package instructionSMT, 0402
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresLASER TRIMMABLE
structureChi
JESD-609 codee4
Manufacturer's serial numberAR
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.35 mm
Package length1 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.5 mm
method of packingTR, PAPER, 7 INCH
Rated power dissipation(P)0.0625 W
Rated temperature70 °C
resistance1270000 Ω
Resistor typeFIXED RESISTOR
seriesAR
size code0402
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceNickel/Gold (Ni/Au)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage50 V
Electronic Design Competition Dot Matrix Electronic Display Screen Information
Electronic Design Competition Dot Matrix Electronic Display Screen InformationAbstract The LED large screen display system, with AT89S52 single chip microcomputer as the core, consists of keyboard dis...
兰博 Electronics Design Contest
Introduction to TOPWAY Intelligent Module Interface Development Tool
Introduction to interface development toolsThe interface development tool is a software specially used to design the display interface. There is no need to write code to design the interface. The tool...
慈俭不敢为人先 FPGA/CPLD
About copper plating rule setting
In AD9, have you ever tried to set the AGND copper spacing on the top layer to 25mil, the AGND copper spacing on the bottom layer to 10mil, and the DGND top and bottom layer copper spacing to 15mil?...
呜呼哀哉 PCB Design
Recruiting WIFI/BT/GPS (any direction) technical experts
Recruitment position: RD, senior RF engineer (any direction of WIFI/BT/GPS)Work location: Shenzhen/Dongguan/ShanghaiCompany: Leading domestic mobile phone manufacturerEducation: Bachelor degree or abo...
Belive_power Recruitment
[Next week’s live broadcast] Quickly get started with the latest TI SimpleLink MCU - low power consumption, multi-band real-time measurement
[align=left][size=3][color=#000000][b]Real-time measurement with low power consumption? The latest SimpleLink MCUs raise their hands and say: I can! [/b][/color][color=#000]Equipped with an enhanced u...
EEWORLD社区 TI Technology Forum

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号