30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| Parts packaging code | SC-70 |
| package instruction | SC-70, 5 PIN |
| Contacts | 5 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.0005 µA |
| Nominal Common Mode Rejection Ratio | 93 dB |
| frequency compensation | YES |
| Maximum input offset voltage | 1260 µV |
| JESD-30 code | R-PDSO-G5 |
| JESD-609 code | e0 |
| length | 2 mm |
| low-bias | YES |
| low-dissonance | NO |
| micropower | NO |
| Humidity sensitivity level | 1 |
| Nominal Negative Supply Voltage (Vsup) | |
| Number of functions | 1 |
| Number of terminals | 5 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP5/6,.08 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing | TAPE AND REEL |
| power | NO |
| power supply | 3/5 V |
| Programmable power | NO |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Nominal slew rate | 18 V/us |
| Maximum slew rate | 3.27 mA |
| Supply voltage upper limit | 6 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Nominal Uniform Gain Bandwidth | 30000 kHz |
| Minimum voltage gain | 70800 |
| broadband | NO |
| width | 1.25 mm |
| LMV861MG | LMV861 | LMV861MGX | LMV862 | LMV862MM | LMV862MMX | |
|---|---|---|---|---|---|---|
| Description | 30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers | 30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers | 30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers | 30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers | 30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers | 30 MHz Low Power CMOS, EMI Hardened Operational Amplifiers |
| Is it Rohs certified? | incompatible | - | incompatible | - | incompatible | incompatible |
| Maker | National Semiconductor（TI ） | - | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Parts packaging code | SC-70 | - | SC-70 | - | SOIC | SOIC |
| package instruction | SC-70, 5 PIN | - | SC-70, 5 PIN | - | MSOP-8 | MSOP-8 |
| Contacts | 5 | - | 5 | - | 8 | 8 |
| Reach Compliance Code | _compli | - | _compli | - | _compli | _compli |
| ECCN code | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | 0.0005 µA | - | 0.0005 µA | - | 0.0005 µA | 0.0005 µA |
| Nominal Common Mode Rejection Ratio | 93 dB | - | 93 dB | - | 93 dB | 93 dB |
| frequency compensation | YES | - | YES | - | YES | YES |
| Maximum input offset voltage | 1260 µV | - | 1260 µV | - | 1260 µV | 1260 µV |
| JESD-30 code | R-PDSO-G5 | - | R-PDSO-G5 | - | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609 code | e0 | - | e0 | - | e0 | e0 |
| length | 2 mm | - | 2 mm | - | 3 mm | 3 mm |
| low-bias | YES | - | YES | - | YES | YES |
| low-dissonance | NO | - | NO | - | NO | NO |
| micropower | NO | - | NO | - | NO | NO |
| Humidity sensitivity level | 1 | - | 1 | - | 1 | 1 |
| Number of functions | 1 | - | 1 | - | 2 | 2 |
| Number of terminals | 5 | - | 5 | - | 8 | 8 |
| Maximum operating temperature | 125 °C | - | 125 °C | - | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | - | TSSOP | - | TSSOP | TSSOP |
| Encapsulate equivalent code | TSSOP5/6,.08 | - | TSSOP5/6,.08 | - | TSSOP8,.19 | TSSOP8,.19 |
| Package shape | RECTANGULAR | - | RECTANGULAR | - | SQUARE | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing | TAPE AND REEL | - | TAPE AND REEL | - | RAIL | TAPE AND REEL |
| power | NO | - | NO | - | NO | NO |
| power supply | 3/5 V | - | 3/5 V | - | 3/5 V | 3/5 V |
| Programmable power | NO | - | NO | - | NO | NO |
| Certification status | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | 1.1 mm | - | 1.1 mm | - | 1.09 mm | 1.09 mm |
| Nominal slew rate | 18 V/us | - | 18 V/us | - | 18 V/us | 18 V/us |
| Maximum slew rate | 3.27 mA | - | 3.27 mA | - | 6.35 mA | 6.35 mA |
| Supply voltage upper limit | 6 V | - | 6 V | - | 6 V | 6 V |
| Nominal supply voltage (Vsup) | 3.3 V | - | 3.3 V | - | 3.3 V | 3.3 V |
| surface mount | YES | - | YES | - | YES | YES |
| technology | CMOS | - | CMOS | - | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | - | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING | - | GULL WING | - | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | - | 0.65 mm | - | 0.65 mm | 0.65 mm |
| Terminal location | DUAL | - | DUAL | - | DUAL | DUAL |
| Nominal Uniform Gain Bandwidth | 30000 kHz | - | 30000 kHz | - | 30000 kHz | 30000 kHz |
| Minimum voltage gain | 70800 | - | 70800 | - | 70800 | 70800 |
| broadband | NO | - | NO | - | NO | NO |
| width | 1.25 mm | - | 1.25 mm | - | 3 mm | 3 mm |
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