DRAM MODULE
KMM364E80(8)4CS EDO Mode
8M x 64 DRAM DIMM Using 4Mx16, 4K & 8K Refresh, 5V
GENERAL DESCRIPTION
The Samsung KMM364E80(8)4C is a 4Mx64bits Dynamic
RAM high density memory module. The Samsung
KMM364E80(8)4C consists of eight CMOS 4Mx16bits
DRAMs in TSOP-II 400mil packages and two 20 bits driver IC
in TSSOP package mounted on a 168-pin glass-epoxy sub-
strate. A 0.1 or 0.22uF decoupling capacitor is mounted on
the printed circuit board for each DRAM. The
KMM364E80(8)4C is a Dual In-line Memory Module and is
intended for mounting into 168 pin edge connector sockets.
KMM364E80(8)4CS
FEATURES
• Part Identification
Part number
KMM364E804CS
KMM364E884CS
PKG
TSOPll
TSOPll
Ref.
4K
8K
CBR Ref.
4K/64ms
ROR Ref.
8K/64ms
4K/64ms
• Extended Data Out Mode Operation
• CAS-before-RAS Refresh capability
• RAS-only and Hidden refresh capability
• TTL compatible inputs and outputs
• Single 5V±10% power supply
• JEDEC standard pinout & Buffered PDpin
• Buffered input except RAS and DQ
• PCB : Height(1000mil), double sided component
PERFORMANCE RANGE
Speed
-5
-6
t
RAC
50ns
60ns
t
CAC
18ns
20ns
t
RC
84ns
104ns
t
HPC
20ns
25ns
PIN CONFIGURATIONS
Pin
Front
Pin Front Pin Front Pin
CAS2
RAS0
OE0
V
SS
A0
A2
A4
A6
A8
A10
A12
V
CC
RFU
RFU
V
SS
OE2
RAS2
CAS4
CAS6
W2
V
CC
RSVD
RSVD
DQ18
DQ19
V
SS
DQ20
DQ21
Back
Pin
Back
Pin
Back
V
SS
1
29
2
DQ0 30
DQ1 31
3
4
DQ2 32
DQ3 33
5
6
V
CC
34
DQ4 35
7
DQ5 36
8
DQ6 37
9
10 DQ7 38
11 *DQ8 39
V
SS
12
40
13 DQ9 41
14 DQ10 42
15 DQ11 43
16 DQ12 44
17 DQ13 45
V
CC
18
46
19 DQ14 47
20 DQ15 48
21 DQ16 49
22 *DQ17 50
V
SS
23
51
24 RSVD 52
25 RSVD 53
26
V
CC
54
W0
27
55
28 CAS0 56
57 DQ22 85
V
SS
113 CAS3 141 DQ58
58 DQ23 86 DQ36 114 RAS1 142 DQ59
59
V
CC
87 DQ37 115 RFU 143 V
CC
60 DQ24 88 DQ38 116 V
SS
144 DQ60
61 RFU 89 DQ39 117
145 RFU
A1
62 RFU 90
V
CC
118
A3
146 RFU
63 RFU 91 DQ40 119
147 RFU
A5
64 RFU 92 DQ41 120
148 RFU
A7
65 DQ25 93 DQ42 121
149 DQ61
A9
66 *DQ26 94 DQ43 122 A11 150 *DQ62
67 DQ27 95 *DQ44 123 *A13 151 DQ63
V
SS
124 V
CC
152 V
SS
96
68
V
SS
69 DQ28 97 DQ45 125 RFU 153 DQ64
70 DQ29 98 DQ46 126
154 DQ65
B0
71 DQ30 99 DQ47 127 V
SS
155 DQ66
72 DQ31 100 DQ48 128 RFU 156 DQ67
73
V
CC
101 DQ49 129 RAS3 157 V
CC
74 DQ32 102 V
CC
130 CAS5 158 DQ68
75 DQ33 103 DQ50 131 CAS7 159 DQ69
76 DQ34 104 DQ51 132 PDE 160 DQ70
77 *DQ35 105 DQ52 133 V
CC
161 *DQ71
78
V
SS
106 *DQ53 134 RSVD 162 V
SS
79
PD1 107 V
SS
135 RSVD 163 PD2
80
PD3 108 RSVD 136 DQ54 164 PD4
81
PD5 109 RSVD 137 DQ55 165 PD6
82
PD7 110 V
CC
138 V
SS
166 PD8
83
ID0 111 RFU 139 DQ56 167 ID1
84
V
CC
112 CAS1 140 DQ57 168 V
CC
PIN NAMES
Pin Names
A0, B0, A1 - A11
A0, B0, A1 - A12
DQ0 - DQ71
W0, W2
OE0, OE2
RAS0 - RAS3
CAS0 - CAS7
V
CC
V
SS
NC
PDE
PD1 - 8
ID0 - 1
RSVD
RFU
Function
Address Input(4K ref.)
Address Input(8K ref.)
Data In/Out
Read/Write Enable
Output Enable
Row Address Strobe
Column Address Strobe
Power(+5V)
Ground
No Connection
Presence Detect Enable
Presence Detect
ID bit
Reserved Use
Reserved for Future Use
Pins marked
′
*
′
are not used in this module.
PD & ID Table
Pin
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
ID0
ID1
50NS
0
0
1
1
1
0
0
1
0
0
60NS
0
0
1
1
1
1
1
1
0
0
NOTE : A12 is used for only KMM364E884CS (8K Ref.)
PD Note :PD & ID Terminals must each be pulled up through a resistor to V
CC
at the next higher
level assembly. PDs will be either open (NC) or driven to V
SS
via on-board buffer circuits.
PD : 0 for Vol of Drive IC & 1 for N.C
ID : 0 for Vss & 1 for N.C
ID Note : IDs will be either open (NC) or connected directly to V
SS
without a buffer.
DRAM MODULE
ABSOLUTE MAXIMUM RATINGS *
Item
Voltage on any pin relative V
SS
Voltage on V
CC
supply relative to V
SS
Storage Temperature
Power Dissipation
Short Circuit Output Current
Symbol
V
IN
, V
OUT
V
CC
T
stg
P
D
I
OS
Rating
KMM364E80(8)4CS
Unit
V
V
°C
W
mA
-1 to +7.0
-1 to +7.0
-55 to +125
8
50
* Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to
the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for intended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(Voltage referenced to V
SS
, T
A
= 0 to 70°C)
Item
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Symbol
V
CC
V
SS
V
IH
V
IL
Min
4.5
0
2.4
-1.0
*2
Typ
5.0
0
-
-
Max
5.5
0
V
CC*1
0.8
Unit
V
V
V
V
*1 : V
CC
+2.0V at pulse width≤20ns, which is measured at V
CC
.
*2 : -2.0V at pulse width≤20ns, which is measured at V
SS
.
DC AND OPERATING CHARACTERISTICS
(Recommended operating conditions unless otherwise noted)
Symbol
I
CC1
I
CC2
I
CC3
I
CC4
I
CC5
I
CC6
I
I(L)
I
O(L)
V
OH
V
OL
Speed
-5
-6
Don′t care
-5
-6
-5
-6
Don′t care
-5
-6
Don′t care
Don′t care
KMM364E804CS
Min
-
-
KMM364E884CS
Min
-
-
-
-
-
-
-
-
-
-
-10
-10
2.4
-
Max
460
420
100
460
420
500
460
30
460
420
10
10
-
0.4
Max
580
540
100
580
540
540
500
30
580
540
10
10
-
0.4
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
uA
uA
V
V
-
-
-
-
-
-
-
-
-10
-10
2.4
-
I
CC1
* : Operating Current * (RAS, CAS, Address cycling @
t
RC
=min)
I
CC2
: Standby Current (RAS=CAS=W=V
IH
)
I
CC3
* : RAS Only Refresh Current * (CAS=V
IH
, RAS cycling @
t
RC
=min)
I
CC4
* : Extended Data Out Mode Current * (RAS=V
IL
, CAS cycling :
t
HPC
=min)
I
CC5
: Standby Current (RAS=CAS=W=Vcc-0.2V)
I
CC6
* : CAS-Before-RAS Refresh Current * (RAS and CAS cycling @
t
RC
=min)
I(
IL)
: Input Leakage Current (Any input 0≤V
IN
≤Vcc+0.5V,
all other pins not under test=0 V)
I(
OL)
: Output Leakage Current(Data Out is disabled, 0V≤V
OUT
≤Vcc)
V
OH
: Output High Voltage Level (I
OH
= -5mA)
V
OL
: Output Low Voltage Level (I
OL
= 4.2mA)
* NOTE
: I
CC1
, I
CC3
, I
CC4
and I
CC6
are dependent on output loading and cycle rates. Specified values are obtained with the output open.
I
CC
is specified as an average current. In I
CC1
and I
CC3
, address can be changed maximum once while RAS=V
IL
. In I
CC4
,
address can be changed maximum once within one EDO mode cycle time,
t
HPC
.