Flash Module, 128KX32, 150ns, CQFP68, CERAMIC, LQFP-68
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
Parts packaging code | QFP |
package instruction | QFF, |
Contacts | 68 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.2.C |
Maximum access time | 150 ns |
Other features | CONFIGURABLE AS 128K X 32 |
JESD-30 code | S-CQFP-F68 |
JESD-609 code | e4 |
length | 39.6 mm |
memory density | 4194304 bit |
Memory IC Type | FLASH MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 128KX32 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QFF |
Package shape | SQUARE |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.56 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | GOLD |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 39.6 mm |