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IS62WV25616DBLL-45TLI |
IS62WV25616DBLL-45BLI |
Description |
Standard SRAM, 256KX16, 45ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 |
Standard SRAM, 256KX16, 45ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48 |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Parts packaging code |
TSOP2 |
DSBGA |
package instruction |
TSOP2, TSOP44,.46,32 |
TFBGA, BGA48,6X8,30 |
Contacts |
44 |
48 |
Reach Compliance Code |
compliant |
compliant |
ECCN code |
3A991.B.2.A |
3A991.B.2.A |
Factory Lead Time |
8 weeks |
8 weeks |
Maximum access time |
45 ns |
45 ns |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-PDSO-G44 |
R-PBGA-B48 |
JESD-609 code |
e3 |
e1 |
length |
18.41 mm |
8 mm |
memory density |
4194304 bit |
4194304 bit |
Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
memory width |
16 |
16 |
Humidity sensitivity level |
3 |
3 |
Number of functions |
1 |
1 |
Number of terminals |
44 |
48 |
word count |
262144 words |
262144 words |
character code |
256000 |
256000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
organize |
256KX16 |
256KX16 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP2 |
TFBGA |
Encapsulate equivalent code |
TSOP44,.46,32 |
BGA48,6X8,30 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
2.5/3.3 V |
2.5/3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.2 mm |
Maximum standby current |
0.000007 A |
0.000007 A |
Minimum standby current |
1.2 V |
1.2 V |
Maximum slew rate |
0.018 mA |
0.018 mA |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
MATTE TIN |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
GULL WING |
BALL |
Terminal pitch |
0.8 mm |
0.75 mm |
Terminal location |
DUAL |
BOTTOM |
Maximum time at peak reflow temperature |
40 |
40 |
width |
10.16 mm |
6 mm |