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IS62WV25616DBLL-45TLI

Description
Standard SRAM, 256KX16, 45ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44
Categorystorage    storage   
File Size324KB,17 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS62WV25616DBLL-45TLI Overview

Standard SRAM, 256KX16, 45ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44

IS62WV25616DBLL-45TLI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP2
package instructionTSOP2, TSOP44,.46,32
Contacts44
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Factory Lead Time8 weeks
Samacsys DescriptionSTATIC SRAM
Maximum access time45 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G44
JESD-609 codee3
length18.41 mm
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals44
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP44,.46,32
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000007 A
Minimum standby current1.2 V
Maximum slew rate0.018 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width10.16 mm

IS62WV25616DBLL-45TLI Related Products

IS62WV25616DBLL-45TLI IS62WV25616DBLL-45BLI
Description Standard SRAM, 256KX16, 45ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 Standard SRAM, 256KX16, 45ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSOP2 DSBGA
package instruction TSOP2, TSOP44,.46,32 TFBGA, BGA48,6X8,30
Contacts 44 48
Reach Compliance Code compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A
Factory Lead Time 8 weeks 8 weeks
Maximum access time 45 ns 45 ns
I/O type COMMON COMMON
JESD-30 code R-PDSO-G44 R-PBGA-B48
JESD-609 code e3 e1
length 18.41 mm 8 mm
memory density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 16 16
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 44 48
word count 262144 words 262144 words
character code 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 256KX16 256KX16
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TFBGA
Encapsulate equivalent code TSOP44,.46,32 BGA48,6X8,30
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260
power supply 2.5/3.3 V 2.5/3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm
Maximum standby current 0.000007 A 0.000007 A
Minimum standby current 1.2 V 1.2 V
Maximum slew rate 0.018 mA 0.018 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface MATTE TIN Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form GULL WING BALL
Terminal pitch 0.8 mm 0.75 mm
Terminal location DUAL BOTTOM
Maximum time at peak reflow temperature 40 40
width 10.16 mm 6 mm
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