IS62WV25616DBLL-45BLI datasheet, PDF

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IS62WV25616DBLL-45BLI: DescriptionStandard SRAM, 256KX16, 45ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48; Categorystorage storage; File Size324KB，17 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS62WV25616DBLL-45BLI Overview

Standard SRAM, 256KX16, 45ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48

IS62WV25616DBLL-45BLI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	DSBGA
package instruction	TFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Factory Lead Time	8 weeks
Maximum access time	45 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	8 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.000007 A
Minimum standby current	1.2 V
Maximum slew rate	0.018 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	6 mm

IS62WV25616DBLL-45BLI Related Products

	IS62WV25616DBLL-45BLI	IS62WV25616DBLL-45TLI
Description	Standard SRAM, 256KX16, 45ns, CMOS, PBGA48, 6 X 8 MM, LEAD FREE, MO-207, TFBGA-48	Standard SRAM, 256KX16, 45ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	DSBGA	TSOP2
package instruction	TFBGA, BGA48,6X8,30	TSOP2, TSOP44,.46,32
Contacts	48	44
Reach Compliance Code	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A
Factory Lead Time	8 weeks	8 weeks
Maximum access time	45 ns	45 ns
I/O type	COMMON	COMMON
JESD-30 code	R-PBGA-B48	R-PDSO-G44
JESD-609 code	e1	e3
length	8 mm	18.41 mm
memory density	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	16	16
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	48	44
word count	262144 words	262144 words
character code	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	256KX16	256KX16
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TSOP2
Encapsulate equivalent code	BGA48,6X8,30	TSOP44,.46,32
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260
power supply	2.5/3.3 V	2.5/3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm
Maximum standby current	0.000007 A	0.000007 A
Minimum standby current	1.2 V	1.2 V
Maximum slew rate	0.018 mA	0.018 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	MATTE TIN
Terminal form	BALL	GULL WING
Terminal pitch	0.75 mm	0.8 mm
Terminal location	BOTTOM	DUAL
Maximum time at peak reflow temperature	40	40
width	6 mm	10.16 mm

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