WS27C210L-15LMB datasheet, PDF

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WS27C210L-15LMB: DescriptionUVPROM, 64KX16, 150ns, CMOS, CQCC44,; Categorystorage storage; File Size303KB，5 Pages; ManufacturerWaferscale Integration Inc.

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WS27C210L-15LMB Overview

UVPROM, 64KX16, 150ns, CMOS, CQCC44,

WS27C210L-15LMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Waferscale Integration Inc.
Reach Compliance Code	unknown
Maximum access time	150 ns
I/O type	COMMON
JESD-30 code	S-CQCC-J44
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	16
Number of functions	1
Number of terminals	44
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX16
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.0001 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED

WS27C210L-15LMB Related Products

	WS27C210L-15LMB	WS27C210L-17CMB	WS27C210L-15DMB	WS27C210L-12CMB	WS27C210L-17DMB	WS27C210L-12DMB	WS27C210L-15CMB
Description	UVPROM, 64KX16, 150ns, CMOS, CQCC44,	UVPROM, 64KX16, 170ns, CMOS, CQCC44,	UVPROM, 64KX16, 150ns, CMOS, CDIP40,	UVPROM, 64KX16, 120ns, CMOS, CQCC44,	UVPROM, 64KX16, 170ns, CMOS, CDIP40,	UVPROM, 64KX16, 120ns, CMOS, CDIP40,	UVPROM, 64KX16, 150ns, CMOS, CQCC44,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Maximum access time	150 ns	170 ns	150 ns	120 ns	170 ns	120 ns	150 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CQCC-J44	R-CQCC-N44	R-GDIP-T40	R-CQCC-N44	R-GDIP-T40	R-GDIP-T40	R-CQCC-N44
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1
Number of terminals	44	44	40	44	40	40	44
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ	QCCN	DIP	QCCN	DIP	DIP	QCCN
Encapsulate equivalent code	LDCC44,.7SQ	LCC44,.65SQ	DIP40,.6	LCC44,.65SQ	DIP40,.6	DIP40,.6	LCC44,.65SQ
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	QUAD	QUAD	DUAL	QUAD	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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