1812GC302MAT9A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> 1812GC302MAT9A

1812GC302MAT9A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 2000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.003uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT; CategoryPassive components capacitor; File Size70KB，2 Pages; ManufacturerAVX; Environmental Compliance

Download Datasheet Parametric View All

1812GC302MAT9A Overview

Ceramic Capacitor, Multilayer, Ceramic, 2000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.003uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT

1812GC302MAT9A Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	AVX
package instruction	, 1812
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.003 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	2.54 mm
JESD-609 code	e3
length	4.5 mm
Manufacturer's serial number	1812
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	20%
Rated (DC) voltage (URdc)	2000 V
series	SIZE(HIGH VOLTAGE)
size code	1812
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	3.2 mm

Preview

Download Datasheet

View All

High Voltage MLC Chips

For 600V to 5000V Applications

High value, low leakage and small size are difficult parameters to obtain

in capacitors for high voltage systems. AVX special high voltage MLC

chip capacitors meet these performance characteristics and are

designed for applications such as snubbers in high frequency power

converters, resonators in SMPS, and high voltage coupling/dc blocking.

These high voltage chip designs exhibit low ESRs at high frequencies.

Larger physical sizes than normally encountered chips are used to make

high voltage MLC chip products. Special precautions must be taken in

applying these chips in surface mount assemblies. The temperature

gradient during heating or cooling cycles should not exceed 4ºC per

second. The preheat temperature must be within 50ºC of the peak tem-

perature reached by the ceramic bodies through the soldering process.

Chip sizes 1210 and larger should be reflow soldered only. Capacitors

may require protective surface coating to prevent external arcing.

For 1825, 2225 and 3640 sizes, AVX offers leaded version in either

thru-hole or SMT configurations (for details see section on high voltage

leaded MLC chips).

NEW 630V RANGE

HOW TO ORDER

1808

AVX

Style

0805

1206

1210

1808

1812

1825

2220

2225

3640

***

Voltage

600V/630V =

1000V =

1500V =

2000V =

2500V =

3000V =

4000V =

5000V =

271

Temperature Capacitance Code Capacitance

Test Level

Termination*

Coefficient

(2 significant digits

Tolerance

A = Standard 1 = Pd/Ag

C0G = A

+ no. of zeros)

C0G:J = ±5%

T = Plated

X7R = C

Examples:

K = ±10%

Ni and Sn

(RoHS Compliant)

10 pF = 100

M = ±20%

100 pF = 101 X7R:K = ±10%

1,000 pF = 102

M = ±20%

22,000 pF = 223

Z = +80%,

220,000 pF = 224

-20%

1 μF = 105

Packaging

Special

1 = 7" Reel

Code

3 = 13" Reel A = Standard

9 = Bulk

*Note:

Terminations with 5% minimum lead (Pb) is available, see pages 84 and 85 for LD style.

Leaded terminations are available, see pages 88 and 89.

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

***

AVX offers nonstandard chip sizes. Contact factory for details.

DIMENSIONS

SIZE

(L) Length

millimeters (inches)

0805

1206

1210*

1808*

1812*

1825*

2220*

2225*

3640*

2.01 ± 0.20

3.20 ± 0.20

4.57 ± 0.25

4.50 ± 0.30

5.70 ± 0.40

5.72 ± 0.25

9.14 ± 0.25

(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)

(W) Width

1.25 ± 0.20

1.60 ± 0.20

2.50 ± 0.20

2.03 ± 0.25

3.20 ± 0.20

6.40 ± 0.30

5.00 ± 0.40

6.35 ± 0.25

10.2 ± 0.25

(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)

(T) Thickness

1.30

1.52

1.70

2.03

2.54

3.30

2.54

Max.

(0.051)

(0.060)

(0.067)

(0.080)

(0.100)

(0.130)

(0.100)

(t) terminal min. 0.50 ± 0.25

0.25 (0.010)

0.76 (0.030)

max. (0.020 ± 0.010) 0.75 (0.030)

0.75 (0.030)

1.02 (0.040)

1.52 (0.060)

*Reflow Soldering Only

Recommended Resources

binary encoding circuit

Interface circuit between CMOS and HTL b

Warm current power supply circuit b

Simple charger circuit that stops when fully charged

Pocket TV signal generator circuit

Temperature detection, voltage-frequency conversion circuit

Linear thyristor power supply dimming and EMC issues: There is a problem that has troubled me for a long time, as shown in the figure above. This is the schematic diagram of the linear thyristor power supply. When the X capacitor is not added, the EMC te...; cpfpost Power technology

Synopsys IP Resources: A look at the complete Ethernet PHY IP for high-performance computing SoCs: IntroductionHyperscale data centers need to scale as system demands increase. Ethernet has become the preferred network protocol for server-to-server communications required by hyperscale data centers...; arui1999 Integrated technical exchanges

[National Technology N32 MCU Development Package] --N32G4FR Series: ...; milafan Domestic Chip Exchange

CC3220 Wireless MCU LaunchPad Development Kit Design: Among TI’s wireless MCUs is the CC3220 dual-core device, which includes an ARM? Cortex?-M4 core and a dedicated network processor core with an integrated transceiver. The MCU is available in three var...; 火辣西米秀 Wireless Connectivity

422 Driver Output Level: Why does the same 422 driver chip have different signals and different output high levels? When passing a pulse signal with a pulse width of 10ms and 1Hz, the output high level is 4.5V, but when passi...; nanasong Analog electronics

NB-IoT application classification and technical characteristics analysis: NB-Iot stands out as a narrowband Internet of Things technology in various industries, and its applications cover multiple fields. In this article, the editor of Jixun will explain the main applicatio...; Jacktang Wireless Connectivity

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components