3.3V 256K x 2/36 Flowthrough Synchronous SRAM with NTD
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | ALSC [Alliance Semiconductor Corporation] |
Parts packaging code | QFP |
package instruction | LQFP, |
Contacts | 100 |
Reach Compliance Code | unknow |
ECCN code | 3A991.B.2.A |
Maximum access time | 10 ns |
Other features | FLOW-THROUGH ARCHITECTURE |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e3 |
length | 20 mm |
memory density | 8388608 bi |
Memory IC Type | ZBT SRAM |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX32 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 245 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 14 mm |