EEWORLDEEWORLDEEWORLD

Part Number

Search

BH131682J

Description
Array/Network Resistor, Bussed, Metal Glaze/thick Film, 3W, 150V, 5% +/-Tol, 100ppm/Cel, Through Hole Mount, SIP-13
CategoryPassive components    The resistor   
File Size54KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

BH131682J Overview

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 3W, 150V, 5% +/-Tol, 100ppm/Cel, Through Hole Mount, SIP-13

BH131682J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTT Electronics plc
package instructionSIP-13
Reach Compliance Codecompliant
Component power consumption0.25 W
The first element resistor6800 Ω
JESD-609 codee0
Installation featuresTHROUGH HOLE MOUNT
Network TypeBUSSED
Number of components12
Number of functions1
Number of terminals13
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
Rated power dissipation(P)3 W
Rated temperature70 °C
Resistor typeARRAY/NETWORK RESISTOR
surface mountNO
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Temperature coefficient tracking50 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeFLAT
Tolerance5%
Operating Voltage150 V
MODEL BH SERIES
High Profile SIP
Thick Film
Conformal Coated
Resistor Networks
ELECTRICAL
Standard Resistance Range, Ohms
Standard Resistance Tolerance, at 25°C
Operating Temperature Range
Temperature Coefficient of Resistance
Temperature Coefficient of Resistance, Tracking
Maximum Operating Voltage
Insulation Resistance
ENVIRONMENTAL
22 to 1Meg
±2%
Optional: ±1% (F Tol.), ±5% (J Tol.)
-55°C to +155°C
±100ppm/°C (<100 Ohms = ±250ppm/°C)
±50ppm/°C
150Vdc or
√PR
≥10,000
Megohms
4
Thermal Shock plus Power Conditioning
Short Time Overload
Terminal Strength
Moisture Resistance
Mechanical Shock
Vibration
Low Temperature Storage
High Temperature Exposure
Load Life, 1,000 Hours
Resistance to Solder Heat (Per MIL-STD-202, Method 210, Cond.B)
Dielectric Withstanding Voltage
Marking Permanency
Lead Solderability
Flammability
Storage Temperature Range
Specifications subject to change without notice.
∆R
0.50%
∆R
0.50%
∆R
0.25%
∆R
0.50%
∆R
0.25%
∆R
0.25%
∆R
0.25%
∆R
0.50%
∆R
2.00%
∆R
0.25%
200V for 1 minute
MIL-STD-202, Method 215
MIL-STD-202, Method 208
UL-94V-O Rated
-55°C to +155°C
4-17
Model BH Series
MII RMII RGMII GMII
Recently I have been studying routines in a FPGA from Heijin, one of which is a non-IP core Gigabit Ethernet routine. I want to write down my learning experience and lessons, and hope that everyone wi...
heningbo FPGA/CPLD
Please delete this article
[i=s]This post was last edited by anthony0424 on 2021-8-13 16:34[/i]Please delete this article...
anthony0424 51mcu
Wi-Fi architecture and future development of Wi-Fi standards
The common architecture of today's Wi-Fi products and the features they support, including the hardware requirements from Wi-Fi 4 (802.11n) to the latest Wi-Fi 6 (802.11ax). Wi-Fi 6E (6GHz 802.11ax), ...
alan000345 RF/Wirelessly
Problems encountered when opening old version with new version of IAR and solutions
1.__nounwind declaration is incompatible with "__nounwind __interwork __softfp unsigned int __iar_builtin_STREXB(unsigned char, unsigned char volatile *)Solution: Right-click the project and enter opt...
fish001 Microcontroller MCU
What are the differences between Bluetooth and WiFi in IoT wireless technologies?
In the current environment of the explosive development of the Internet of Things, the number of connected devices is increasing, and wireless communication technology is playing an increasingly impor...
成都亿佰特 RF/Wirelessly
[Chuanglong TL570x-EVM] Transplantation of artificial intelligence framework and implementation
[i=s]This post was last edited by Beifang on 2022-6-21 16:57[/i]Transplantation of artificial intelligence framework and implementation 1 There are many ways to port the AI framework and implementatio...
北方 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号