1676855-4 datasheet, PDF - EEWORLD Datasheet

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1676855-4: DescriptionCAPACITOR, CERAMIC, MULTILAYER, 100V, C0G, 0.00000082uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT; CategoryPassive components capacitor; File Size334KB，8 Pages; ManufacturerTE Connectivity; Websitehttp://www.te.com; Environmental Compliance

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1676855-4 Overview

CAPACITOR, CERAMIC, MULTILAYER, 100V, C0G, 0.00000082uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT

1676855-4 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	TE Connectivity
package instruction	, 0603
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	8.2e-7 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
Manufacturer's serial number	TYC
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
positive tolerance	5%
Rated (DC) voltage (URdc)	100 V
size code	0603
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal shape	WRAPAROUND

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Multilayer Ceramic Chip Capacitor

Type TYC Series

Key Features

Choice of Dielectrics

(NP0, X7R, X5R, Y5V)

0402 to 1812 sizes as

standard

Other sizes available.

0201 available soon

6.3V to 50V in standard

range

Voltage ratings to 3kV

on selected products

Range of tolerances

available

RoHS Compliant

Excellent thermal stability

Low dissipation factor

Multilayer ceramic capacitors (MLCC) are manufactured by suspending ceramic powders in

liquid and casting into a thin green sheet from 20mm in thickness to 5mm or thinner.

Metal electrodes are sieved printed onto green sheets, which are later stacked to form a

laminated structure. The metal electrodes are arranged so that the termination alternates from

one edge to another of the capacitor.

Upon sintering at high temperature the part becomes a monolithic block, which can provide

an extremely high capacitance in small mechanical volumes.

Finally, the termination electrodes are formed by composite of outer metal-glass electrode and

followed by a barrier layer and pure-tin plating to permit MLCC to be soldered directly onto

printed circuit board.

Structure

End Termination

(4)

(5)

(3)

Ceramic

(1) Dielectric

(2) Internal

Electrode

Class 1

End Terminal

Specifications

Ceramic dielectric

Internal Electrode

Inner Layer

Middle Layer

Outer Layer

Material

Barium titanate base

Pb, PdAg

Class 2

End Terminal

Internal Electrode

Inner Layer

Middle Layer

Outer Layer

Specifications

Ceramic dielectric

Pb, PbAg

Material

Barium titanate base

1773291 CIS BI 06/2011

Dimensions are in millimeters

and inches unless otherwise

specified. Values in brackets

are standard equivalents.

Dimensions are shown for

reference purposes only.

Specifications subject

to change.

For email, phone or live chat, go to:

te.com/help

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