MC145146FN1 datasheet, PDF - EEWORLD Datasheet

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MC145146FN1: DescriptionPLL/Frequency Synthesis Circuit, CMOS, PQCC20; CategoryAnalog mixed-signal IC The signal circuit; File Size68KB，1 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MC145146FN1 Overview

PLL/Frequency Synthesis Circuit, CMOS, PQCC20

MC145146FN1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
Reach Compliance Code	unknown
JESD-30 code	S-PQCC-J20
JESD-609 code	e0
Number of terminals	20
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC20,.4SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD

MC145146FN1 Related Products

	MC145146FN1	MC145146L	MC145146L1D	MC145146L1S	MC145146LDS	MC145146L1DS	MC145146LS
Description	PLL/Frequency Synthesis Circuit, CMOS, PQCC20	PLL/Frequency Synthesis Circuit, CMOS, CDIP20	PLL/Frequency Synthesis Circuit, CMOS, CDIP20	PLL/Frequency Synthesis Circuit, CMOS, CDIP20	PLL/Frequency Synthesis Circuit, CMOS, CDIP20	PLL/Frequency Synthesis Circuit, CMOS, CDIP20	PLL/Frequency Synthesis Circuit, CMOS, CDIP20
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-PQCC-J20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	20	20	20	20	20	20	20
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCJ	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	LDCC20,.4SQ	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	YES	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-	-	Not Qualified

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