Indicates performance and reliability requirements. "B" level represents standard reliability."T" level represents high reliability.
Please refer to performance specification sheet MIL-PRF-49470 for details regarding test levels. The latest revision of the specification sheet is available through DSCC.
1, 3
Test level option "T" is not available on encapsulated stacked devices (i.e. MIL-PRF-49470/2).
2
Dielectric classification and characteristic details are outlined in the "Electrical Parameters" section of this document.
4
Lead configuration and dimension details are outlined in the "Dimensions" section of this document.
1
1
KPS MIL Series, SMPS Stacks Ordering Information
(Do not use this ordering code if a QPL MIL-SPEC part type is required. Please order using MIL-SPEC ordering code. Details
regarding MIL-PRF-49470 QPL ordering information is outlined above.)
L1
1
R
N
30
C
106
K
S
Testing Option
4
12
Maximum Height
Dimension (in.)
5
Dielectric
Lead
Product Family Classification/
Configuration
3
Characteristic
2
L1 =
Unencapsulated
L2 =
Encapsulated
Q = BQ
R = BR
X = BX
W = X7R
N = Straight
L = Formed "L"
M= Formed "L"
J= Formed "J"
K= Formed "J"
Case Size /
Rated
Capacitance Capacitance
Case Code
Voltage (DC) Code (pF)
Tolerance
(CC)
30 = CC 3
40 = CC 4
50 = CC 5
3 = 25V 2 Sig. Digits J = ±5%
5 = 50V + Number of K = ±10%
1 = 100V
Zeros
M = ±20%
2 = 200V
C = 500V
B = 630V
D = 1000V
B = M49470 "B" Level Unencapsulated Encapsulated
T = M49470 "T" Level
12 = 0.12"
27 = 0.27"
C = DSCC87106
24 = 0.24"
39 = 0.39"
S = Commercial
36 = 0.36"
53 = 0.53"
X = Non-Standard
48 = 0.48"
66 = 0.66"
(Customer Specific
65 = 0.65"
80 = 0.80"
Requirements)
,
Test level option "T" is not available on encapsulated stacked devices, i.e., MIL-PRF-49470/2. If a QPL MIL-Spec part type is required, please order using the
MIL-Spec ordering code.
2
Dielectric classification and characteristic details are outlined in the ""Electrical Parameters"" section of this document.
3
Lead configuration and dimension details are outlined in the "Dimensions" section of this document. Additional lead configurations may be available. Contact
KEMET for details.
4
Indicates performance and reliability requirements. Testing option details are outlined in the "Performance and Reliability" section of this document.
4
Please refer to performance specification sheet MIL-PRF-49470 for additional details regarding test levels. The latest revision of the specification sheet is
available through DSCC.
4
DSCC Drawing 87106 was cancelled on 01/03/2005. MIL-PRF-49470 capacitors are preferred over DSCC Drawing 87106 capacitors.
5
Maximum height dimensions are provided in product tables 1A, 1B, and 1C of this document
1
4
Ordering Information Requirements per DSCC Drawing 87106
DSCC Drawing 87106 was cancelled on 01/03/2005. Customers can continue to order per 87106 requirements using the original DSCC ordering code,i.e., 87106-001.
When available, MIL-PRF-49470 devices are preferred over DSCC Drawing 87106. The MIL-PRF-49470 military specification product provides additional quality
assurance provisions that are not required by the DSCC drawing. These extra provisions create a more robust replacement.
1. Unless otherwise specified, tolerances are ±.010" (0.25mm).
2. Metric equivalents for C, D and E dimensions are provided for general information only.
3. For maximum B dimension, add .065" (1.65mm) to the appropriate A dimension. For all lead styles, the number of chips is determined by the capacitance and
voltage rating.
4. For case code 5, dimensions shall be .100" (2.54mm) maximum and .012” (0.30mm) minimum.
5. Lead alignment within pin rows shall be within ±.005" (0.13mm).
Unencapsulated & Encapsulated Lead Configurations – Inches (Millimeters)
Lead Style
Symbol
N
L
M
J
K
(J) Formed
Lead Style
(N) Straight
(L) Formed
L
Lead Length
0.250 Min. (6.35)
0.070 ± 0.010 (1.78 ± 0.25)
0.045 ± 0.010 (1.14 ± 0.25)
0.070 ± 0.010 (1.78 ± 0.25)
0.045 ± 0.010 (1.14 ± 0.25)
Additional lead configurations may be available. Contact KEMET for details.
[i=s]This post was last edited by DIAG on 2019-3-24 22:01[/i] [size=5]It’s still the old 32 Skyworth LCD TV, with simple functions, suitable for my grandma. The auxiliary 5V power supply was repaired ...
The difference and usage of passive crystal and active crystal oscillator :This content is originally created by EEWORLD forum userzkj2014. If you need to reprint or use it for commercial purposes, yo...
The title of this chip in the review is: Ateli AT-START-F425, the first choice for USB and CAN applications
Now let's start the basic use of CAN:
1. Add can.h and can.c to the drivers folder:
The RX o...
Figure (01) shows the circuit of the UC1525A (same as UC2535A and UC3525A, the three models differ only in the operating temperature range) switching power supply control chip produced by Unitrode (ac...
It's a busy New Year's Eve. I've been busy since early morning. I just had some free time~
Here, I wish you all a happy new year~~
I wish you all a happy new year and all the best! ! ! !...
Huawei Mate 30 Pro mobile phone has begun to push the HarmonyOS 2.0.0.166 log version internal test update, which is 367MB in size. This update mainly adds multi-camera shooting mode, quick...[Details]
Needle valve is a kind of valve that can be precisely adjusted. It has a wide range of uses, such as the cutting distance for flame cutting and the knob for adjusting the flame temperature. Instrum...[Details]
1. Introduction to the principle of matrix keyboard In the previous article, we introduced the use of independent keys. Independent keys require each key to use an IO port for reading. If there are m...[Details]
Function of
the circuit
Semiconductor
CI temperature
sensor
can obtain output that is linearly related to temperature change, without using linear output and lineariz...[Details]
Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal ...[Details]
Aiming at the common problems existing in the traditional electric heating temperature measurement and control system and the design requirements of digital control instruments, a temperature contr...[Details]
[Xpeng humanoid
robot
debuts! With self-developed joints, ultra-lightweight humanoid arms + dexterous hands, it may appear in stores to sell cars next year]
At the 1024 Technology Da...[Details]
In 2019, Jinan Power Supply Company fully implemented the strategic requirements of State Grid Corporation of China for the construction of ubiquitous power Internet of Things, promoted the constru...[Details]
STM32F1xx official information: "STM32 Chinese Reference Manual V10" - Chapter 23 Serial Peripheral Interface SPI Basic Introduction to SPI Introduction to SPI SPI is the abbreviation of Serial P...[Details]
No matter how varied the forms of power supplies and electronic products are, the core PCB layout and the combination of various components remain unchanged. Designing and building power electronic p...[Details]
1 Introduction When the vehicle is driving, the DYC (yaw torque) circuit is in working state. In case of emergency, the brakes need to be stepped on for control. At this time, the DYC circuit stops...[Details]
Jiwei.com reported on April 15 that the official Weibo account of iQOO announced a good news, that is, iQOO 7 has added a new 8+256GB storage version, priced at 3,898 yuan. Previously, iQOO 7 only ha...[Details]
Overview
As the level of automobile electrification increases, automobile maintenance becomes more and more complicated. High-tech maintenance equipment from many manufacturers at home and abr...[Details]
summary
The fifth article in this series explains the importance of auxiliary power in the Analog Devices Battery Backup Unit (BBU) reference design. Auxiliary power consists of a ...[Details]