0.5 A, SILICON, SIGNAL DIODE
SAM50FA_1 | SAM50FASMSS | SAM50FASMSTX | SAM50FASMSTXV | |
---|---|---|---|---|
Description | 0.5 A, SILICON, SIGNAL DIODE | 0.5 A, SILICON, SIGNAL DIODE | 0.5 A, SILICON, SIGNAL DIODE | 0.5 A, SILICON, SIGNAL DIODE |
package instruction | - | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 |
Contacts | - | 2 | 2 | 2 |
Reach Compliance Code | - | compli | compli | compli |
ECCN code | - | EAR99 | EAR99 | EAR99 |
Is Samacsys | - | N | N | N |
Other features | - | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED |
Shell connection | - | ISOLATED | ISOLATED | ISOLATED |
Configuration | - | SINGLE | SINGLE | SINGLE |
Diode component materials | - | SILICON | SILICON | SILICON |
Diode type | - | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
JESD-30 code | - | E-LELF-R2 | E-LELF-R2 | E-LELF-R2 |
Number of components | - | 1 | 1 | 1 |
Number of terminals | - | 2 | 2 | 2 |
Maximum output current | - | 0.5 A | 0.5 A | 0.5 A |
Package body material | - | GLASS | GLASS | GLASS |
Package shape | - | ELLIPTICAL | ELLIPTICAL | ELLIPTICAL |
Package form | - | LONG FORM | LONG FORM | LONG FORM |
Certification status | - | Not Qualified | Not Qualified | Not Qualified |
Maximum reverse recovery time | - | 0.15 µs | 0.15 µs | 0.15 µs |
surface mount | - | YES | YES | YES |
Terminal form | - | WRAP AROUND | WRAP AROUND | WRAP AROUND |
Terminal location | - | END | END | END |
Base Number Matches | - | 1 | 1 | 1 |