Flash, 1KX8, PDIP8, MINI, PLASTIC, DIP-8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Xicor Inc. |
package instruction | MINI, PLASTIC, DIP-8 |
Reach Compliance Code | unknown |
Other features | 2 WIRE SERIAL INTERFACE |
Maximum clock frequency (fCLK) | 0.1 MHz |
Data retention time - minimum | 100 |
Durability | 100000 Write/Erase Cycles |
I2C control byte | 10DDDMMR |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
length | 10.03 mm |
memory density | 8192 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 1024 words |
character code | 1000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1KX8 |
Output characteristics | OPEN-DRAIN |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 2/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 4.32 mm |
Serial bus type | I2C |
Maximum standby current | 0.000001 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 1.8 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
width | 7.62 mm |
write protect | HARDWARE/SOFTWARE |