|
RM48L950PGET |
RM48L550PGET |
RM48L550ZWTT |
RM48L750PGET |
RM48L750ZWTT |
RM48L950ZWTT |
XRM48L950ZWTT |
Description |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
QFP |
QFP |
BGA |
QFP |
BGA |
BGA |
BGA |
package instruction |
LFQFP, QFP144,.87SQ,20 |
LFQFP, QFP144,.87SQ,20 |
LFBGA, BGA337,19X19,32 |
LFQFP, QFP144,.87SQ,20 |
LFBGA, BGA337,19X19,32 |
BGA, BGA337,19X19,32 |
LFBGA, |
Contacts |
144 |
144 |
337 |
144 |
337 |
337 |
337 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
ECCN code |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
Has ADC |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
Address bus width |
- |
16 |
16 |
16 |
16 |
- |
16 |
bit size |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
maximum clock frequency |
80 MHz |
80 MHz |
80 MHz |
80 MHz |
80 MHz |
80 MHz |
80 MHz |
DAC channel |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
DMA channel |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
External data bus width |
- |
16 |
16 |
16 |
16 |
- |
16 |
JESD-30 code |
S-PQFP-G144 |
S-PQFP-G144 |
S-PBGA-B337 |
S-PQFP-G144 |
S-PBGA-B337 |
X-PBGA-B337 |
S-PBGA-B337 |
JESD-609 code |
e4 |
e4 |
e1 |
e4 |
e1 |
e1 |
e1 |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
Number of I/O lines |
10 |
44 |
44 |
44 |
44 |
16 |
44 |
Number of terminals |
144 |
144 |
337 |
144 |
337 |
337 |
337 |
Maximum operating temperature |
105 °C |
105 °C |
105 °C |
105 °C |
105 °C |
105 °C |
105 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
PWM channel |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFQFP |
LFQFP |
LFBGA |
LFQFP |
LFBGA |
BGA |
LFBGA |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
UNSPECIFIED |
SQUARE |
Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY |
GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
ROM programmability |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
speed |
200 MHz |
200 MHz |
200 MHz |
200 MHz |
200 MHz |
200 MHz |
200 MHz |
Maximum supply voltage |
1.32 V |
1.32 V |
1.32 V |
1.32 V |
1.32 V |
1.32 V |
1.32 V |
Minimum supply voltage |
1.14 V |
1.14 V |
1.14 V |
1.14 V |
1.14 V |
1.14 V |
1.14 V |
Nominal supply voltage |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
GULL WING |
GULL WING |
BALL |
GULL WING |
BALL |
BALL |
BALL |
Terminal pitch |
0.5 mm |
0.5 mm |
0.8 mm |
0.5 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
QUAD |
QUAD |
BOTTOM |
QUAD |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
Maker |
Texas Instruments |
Texas Instruments |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Other features |
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY |
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY |
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY |
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY |
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY |
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY |
- |
CPU series |
CORTEX-R4F |
CORTEX-R4F |
CORTEX-R4F |
CORTEX-R4F |
CORTEX-R4F |
CORTEX-R4F |
- |
length |
20 mm |
20 mm |
16 mm |
20 mm |
16 mm |
- |
16 mm |
Encapsulate equivalent code |
QFP144,.87SQ,20 |
QFP144,.87SQ,20 |
BGA337,19X19,32 |
QFP144,.87SQ,20 |
BGA337,19X19,32 |
BGA337,19X19,32 |
- |
power supply |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
RAM (bytes) |
262144 |
196608 |
196608 |
262144 |
262144 |
262144 |
- |
rom(word) |
3145728 |
2097152 |
2097152 |
2097152 |
2097152 |
3145728 |
- |
Maximum seat height |
1.6 mm |
1.6 mm |
1.4 mm |
1.6 mm |
1.4 mm |
- |
1.4 mm |
width |
20 mm |
20 mm |
16 mm |
20 mm |
16 mm |
- |
16 mm |