W25Q80BVSSAP datasheet, PDF - EEWORLD Datasheet

W25Q80BVSSAP: Description8M X 1 SPI BUS SERIAL EEPROM, PDIP8; Categorystorage storage; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W25Q80BVSSAP Overview

8M X 1 SPI BUS SERIAL EEPROM, PDIP8

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	SOIC
package instruction	SOP, SOP8,.3
Contacts	8
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum clock frequency (fCLK)	80 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	S-PDSO-G8
length	5.28 mm
memory density	8388608 bi
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	8
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
organize	8MX1
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	SQUARE
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	2.16 mm
Serial bus type	SPI
Maximum standby current	0.000005 A
Maximum slew rate	0.018 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
type	NOR TYPE
width	5.28 mm
write protect	HARDWARE/SOFTWARE

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