HYI18T512160B2F-3.7 datasheet, PDF

Datasheet> All Categories > storage> storage> HYI18T512160B2F-3.7

HYI18T512160B2F-3.7: DescriptionDDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84; Categorystorage storage; File Size4MB，69 Pages; ManufacturerQIMONDA; Environmental Compliance

Download Datasheet Parametric Compare View All

HYI18T512160B2F-3.7 Overview

DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84

HYI18T512160B2F-3.7 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	QIMONDA
Parts packaging code	BGA
package instruction	TFBGA, BGA84,9X15,32
Contacts	84
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.5 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	266 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B84
length	12.5 mm
memory density	536870912 bit
Memory IC Type	DDR DRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	84
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA84,9X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	4,8
Maximum standby current	0.003 A
Maximum slew rate	0.22 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	10 mm

HYI18T512160B2F-3.7 Related Products

	HYI18T512160B2F-3.7	HYI18T512800B2F-2.5	HYI18T512160B2F-3S	HYI18T512160B2F-25F	HYI18T512160B2F-2.5	HYI18T512800B2F-25F	HYI18T512160B2F-3	HYI18T512160B2F-5
Description	DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84	DDR DRAM, 64MX8, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60	DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84	DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84	DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84	DDR DRAM, 64MX8, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60	DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84	DDR DRAM, 32MX16, 0.6ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA84,9X15,32	TFBGA, BGA60,9X11,32	TFBGA, BGA84,9X15,32	TFBGA, BGA84,9X15,32	TFBGA, BGA84,9X15,32	TFBGA, BGA60,9X11,32	TFBGA, BGA84,9X15,32	TFBGA, BGA84,9X15,32
Contacts	84	60	84	84	84	60	84	84
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.5 ns	0.4 ns	0.45 ns	0.4 ns	0.4 ns	0.4 ns	0.45 ns	0.6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	266 MHz	400 MHz	333 MHz	400 MHz	400 MHz	400 MHz	333 MHz	200 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
interleaved burst length	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
JESD-30 code	R-PBGA-B84	R-PBGA-B60	R-PBGA-B84	R-PBGA-B84	R-PBGA-B84	R-PBGA-B60	R-PBGA-B84	R-PBGA-B84
length	12.5 mm	10.5 mm	12.5 mm	12.5 mm	12.5 mm	10.5 mm	12.5 mm	12.5 mm
memory density	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	16	8	16	16	16	8	16	16
Humidity sensitivity level	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	84	60	84	84	84	60	84	84
word count	33554432 words	67108864 words	33554432 words	33554432 words	33554432 words	67108864 words	33554432 words	33554432 words
character code	32000000	64000000	32000000	32000000	32000000	64000000	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	32MX16	64MX8	32MX16	32MX16	32MX16	64MX8	32MX16	32MX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA84,9X15,32	BGA60,9X11,32	BGA84,9X15,32	BGA84,9X15,32	BGA84,9X15,32	BGA60,9X11,32	BGA84,9X15,32	BGA84,9X15,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
power supply	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192	8192	8192	8192	8192	8192
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES
Continuous burst length	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
Maximum standby current	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A	0.003 A
Maximum slew rate	0.22 mA	0.153 mA	0.218 mA	0.225 mA	0.223 mA	0.155 mA	0.22 mA	0.22 mA
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40
width	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
Maker	QIMONDA	-	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA

Recommended Resources

Lidar analysis based on SPAD SiPM technology

Pressurized water supply level controller circuit.gif

Pulse frequency multiplier circuit diagram

555 belt conveyor comprehensive protector circuit

High stability integrated regulated power supply composed of CW137 Part 2

845E computer motherboard circuit diagram_47

Chengdu is raging again. When will it end?: On July 15 and July 20, two chains started to cause trouble in Chengdu. . . . The first few days were fine. I watched other urban areas and communities being sealed off and controlled. Yesterday, the ...; freebsder Talking

CircuitPython Application Menu Launcher: This is a very simple application launcher written in CircuitPython, it was inspired by the PyPortal Titano launcher.[hide]https://github.com/beboxos/circuitpython/tree/main/ATMegaZero%20S2/BootMenu[/...; dcexpert MicroPython Open Source section

Recruiting embedded software development engineers: Headhunting position [Hangzhou] Job responsibilities: 1. According to the company's needs, write the outline design document and detailed design document of embedded software; 2. According to the task...; ff318421749 Recruitment

LC resonance: In Figure 8.1.16 of Tongshi Bai Model Electronics, 4th edition, P413, R is the total loss, but where is the load RL? Wasn't there a load RL on the N3 coil originally?...; msddw Analog electronics

The project generated by STM32CubeMX prompts Failed to load flash loader: The development board uses STM32L4R5ZI. I have never encountered this problem before when using STM32CubeMX to generate projects.[code]Failed to load flash loader: D:\Program Files (x86)\IAR Systems\E...; littleshrimp stm32/stm8

SJ73L42: [size=5]1. Is AUK's SJ73L42 used to detect voltage and reset? [/size] [size=5]2. [size=3][/size] How is it specifically used? [/size] [size=5] [/size] [size=5] The attachment is a specification sheet ...; 547298384+ Analog electronics

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components