CD74HCT175E datasheet, PDF - EEWORLD Datasheet

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CD74HCT175E: DescriptionD FLIP-FLOP; Categorylogic logic; File Size321KB，6 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD74HCT175E Overview

D FLIP-FLOP

CD74HCT175E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	D FLIP-FLOP
Maximum Frequency@Nom-Sup	16000000 Hz
MaximumI(ol)	0.004 A
Number of functions	4
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Trigger type	POSITIVE EDGE

CD74HCT175E Related Products

	CD74HCT175E	CD74HC175E	CD74HCT175M	CD74HC175M
Description	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
Maximum Frequency@Nom-Sup	16000000 Hz	20000000 Hz	16000000 Hz	20000000 Hz
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A
Number of functions	4	4	4	4
Number of terminals	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	SOP16,.25	SOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
power supply	5 V	2/6 V	5 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	-	Renesas Electronics Corporation
package instruction	DIP, DIP16,.3	-	SOP, SOP16,.25	SOP, SOP16,.25

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