TRANSISTOR Si, RF SMALL SIGNAL, FET, TO-92, FET RF Small Signal
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | CYLINDRICAL, O-PBCY-T3 |
Reach Compliance Code | unknown |
Configuration | SINGLE |
FET technology | JUNCTION |
JEDEC-95 code | TO-92 |
JESD-30 code | O-PBCY-T3 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 3 |
Maximum operating temperature | 150 °C |
Package body material | PLASTIC/EPOXY |
Package shape | ROUND |
Package form | CYLINDRICAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 0.35 W |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | AMPLIFIER |
Transistor component materials | SILICON |
J300 | 2N4224 | J305 | |
---|---|---|---|
Description | TRANSISTOR Si, RF SMALL SIGNAL, FET, TO-92, FET RF Small Signal | TRANSISTOR,JFET,N-CHANNEL,30V V(BR)DSS,20MA I(DSS),TO-72 | TRANSISTOR N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-92, FET General Purpose Small Signal |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | compli | unknow |
FET technology | JUNCTION | JUNCTION | JUNCTION |
JESD-609 code | e0 | e0 | e0 |
Maximum operating temperature | 150 °C | 175 °C | 150 °C |
Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL |
Maximum power dissipation(Abs) | 0.35 W | 0.3 W | 0.35 W |
surface mount | NO | NO | NO |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maker | National Semiconductor(TI ) | - | National Semiconductor(TI ) |
package instruction | CYLINDRICAL, O-PBCY-T3 | - | CYLINDRICAL, O-PBCY-T3 |
Configuration | SINGLE | - | SINGLE |
JEDEC-95 code | TO-92 | - | TO-92 |
JESD-30 code | O-PBCY-T3 | - | O-PBCY-T3 |
Number of components | 1 | - | 1 |
Number of terminals | 3 | - | 3 |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
Package shape | ROUND | - | ROUND |
Package form | CYLINDRICAL | - | CYLINDRICAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED |
Certification status | Not Qualified | - | Not Qualified |
Terminal form | THROUGH-HOLE | - | THROUGH-HOLE |
Terminal location | BOTTOM | - | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED |
transistor applications | AMPLIFIER | - | AMPLIFIER |
Transistor component materials | SILICON | - | SILICON |