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J300

Description
TRANSISTOR Si, RF SMALL SIGNAL, FET, TO-92, FET RF Small Signal
CategoryDiscrete semiconductor    The transistor   
File Size46KB,1 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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J300 Overview

TRANSISTOR Si, RF SMALL SIGNAL, FET, TO-92, FET RF Small Signal

J300 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionCYLINDRICAL, O-PBCY-T3
Reach Compliance Codeunknown
ConfigurationSINGLE
FET technologyJUNCTION
JEDEC-95 codeTO-92
JESD-30 codeO-PBCY-T3
JESD-609 codee0
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeROUND
Package formCYLINDRICAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.35 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsAMPLIFIER
Transistor component materialsSILICON

J300 Related Products

J300 2N4224 J305
Description TRANSISTOR Si, RF SMALL SIGNAL, FET, TO-92, FET RF Small Signal TRANSISTOR,JFET,N-CHANNEL,30V V(BR)DSS,20MA I(DSS),TO-72 TRANSISTOR N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-92, FET General Purpose Small Signal
Is it Rohs certified? incompatible incompatible incompatible
Reach Compliance Code unknown compli unknow
FET technology JUNCTION JUNCTION JUNCTION
JESD-609 code e0 e0 e0
Maximum operating temperature 150 °C 175 °C 150 °C
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 0.35 W 0.3 W 0.35 W
surface mount NO NO NO
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maker National Semiconductor(TI ) - National Semiconductor(TI )
package instruction CYLINDRICAL, O-PBCY-T3 - CYLINDRICAL, O-PBCY-T3
Configuration SINGLE - SINGLE
JEDEC-95 code TO-92 - TO-92
JESD-30 code O-PBCY-T3 - O-PBCY-T3
Number of components 1 - 1
Number of terminals 3 - 3
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
Package shape ROUND - ROUND
Package form CYLINDRICAL - CYLINDRICAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
Certification status Not Qualified - Not Qualified
Terminal form THROUGH-HOLE - THROUGH-HOLE
Terminal location BOTTOM - BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED
transistor applications AMPLIFIER - AMPLIFIER
Transistor component materials SILICON - SILICON

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