IC,SYNC SRAM,64KX18,BICMOS-TTL,LDCC,52PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | QCCJ, LDCC52,.8SQ |
Reach Compliance Code | unknown |
Maximum access time | 9 ns |
I/O type | COMMON |
JESD-30 code | S-PQCC-J52 |
JESD-609 code | e0 |
memory density | 1179648 bit |
Memory IC Type | STANDARD SRAM |
memory width | 18 |
Number of terminals | 52 |
word count | 65536 words |
character code | 64000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC52,.8SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.075 A |
Minimum standby current | 4.75 V |
Maximum slew rate | 0.275 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
MCM67J618FN9 | MCM67J618FN7 | |
---|---|---|
Description | IC,SYNC SRAM,64KX18,BICMOS-TTL,LDCC,52PIN,PLASTIC | IC,SYNC SRAM,64KX18,BICMOS-TTL,LDCC,52PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible |
Maker | NXP | NXP |
package instruction | QCCJ, LDCC52,.8SQ | QCCJ, LDCC52,.8SQ |
Reach Compliance Code | unknown | unknown |
Maximum access time | 9 ns | 7 ns |
I/O type | COMMON | COMMON |
JESD-30 code | S-PQCC-J52 | S-PQCC-J52 |
JESD-609 code | e0 | e0 |
memory density | 1179648 bit | 1179648 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM |
memory width | 18 | 18 |
Number of terminals | 52 | 52 |
word count | 65536 words | 65536 words |
character code | 64000 | 64000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 64KX18 | 64KX18 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ |
Encapsulate equivalent code | LDCC52,.8SQ | LDCC52,.8SQ |
Package shape | SQUARE | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum standby current | 0.075 A | 0.075 A |
Minimum standby current | 4.75 V | 4.75 V |
Maximum slew rate | 0.275 mA | 0.29 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | YES | YES |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD |