Fast Page DRAM, 8MX8, 60ns, CMOS, PDSO32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
package instruction | TSOP, TSOP32,.46 |
Reach Compliance Code | unknown |
Maximum access time | 60 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G32 |
JESD-609 code | e0 |
memory density | 67108864 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of terminals | 32 |
word count | 8388608 words |
character code | 8000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP |
Encapsulate equivalent code | TSOP32,.46 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 8192 |
self refresh | NO |
Maximum standby current | 0.0005 A |
Maximum slew rate | 0.08 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |