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72131L65J

Description
FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32
Categorystorage    storage   
File Size962KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
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72131L65J Overview

FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32

72131L65J Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time65 ns
Maximum clock frequency (fCLK)12.5 MHz
JESD-30 codeR-PQCC-J32
JESD-609 codee0
memory density18432 bit
Memory IC TypeOTHER FIFO
memory width9
Humidity sensitivity level1
Number of terminals32
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2KX9
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Maximum standby current0.002 A
Maximum slew rate0.14 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30

72131L65J Related Products

72131L65J 72141L35J 72141L65P 72131L120P 72131L120J 72131L65C 72131L65P 72131L80CB 72141S50J
Description FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32 FIFO, 4KX9, 35ns, Asynchronous, CMOS, PQCC32 FIFO, 4KX9, 65ns, Asynchronous, CMOS, PDIP28 FIFO, 2KX9, 120ns, Asynchronous, CMOS, PDIP28 FIFO, 2KX9, 120ns, Asynchronous, CMOS, PQCC32 FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28 FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28 FIFO, 2KX9, 80ns, Asynchronous, CMOS, CDIP28 FIFO, 4KX9, 50ns, Asynchronous, CMOS, PQCC32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 65 ns 35 ns 65 ns 120 ns 120 ns 65 ns 65 ns 80 ns 50 ns
Maximum clock frequency (fCLK) 12.5 MHz 22.2 MHz 12.5 MHz 7.1 MHz 7.1 MHz 12.5 MHz 12.5 MHz 10 MHz 15.4 MHz
JESD-30 code R-PQCC-J32 R-PQCC-J32 R-PDIP-T28 R-PDIP-T28 R-PQCC-J32 R-XDIP-T28 R-PDIP-T28 R-XDIP-T28 R-PQCC-J32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 18432 bit 36864 bit 36864 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9
Number of terminals 32 32 28 28 32 28 28 28 32
word count 2048 words 4096 words 4096 words 2048 words 2048 words 2048 words 2048 words 2048 words 4096 words
character code 2000 4000 4000 2000 2000 2000 2000 2000 4000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 125 °C 70 °C
organize 2KX9 4KX9 4KX9 2KX9 2KX9 2KX9 2KX9 2KX9 4KX9
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY
encapsulated code QCCJ QCCJ DIP DIP QCCJ DIP DIP DIP QCCJ
Encapsulate equivalent code LDCC32,.5X.6 LDCC32,.5X.6 DIP28,.6 DIP28,.6 LDCC32,.5X.6 DIP28,.6 DIP28,.6 DIP28,.6 LDCC32,.5X.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER
Peak Reflow Temperature (Celsius) 225 225 225 225 225 225 225 225 225
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A 0.004 A 0.008 A
Maximum slew rate 0.14 mA 0.14 mA 0.14 mA 0.14 mA 0.14 mA 0.14 mA 0.14 mA 0.16 mA 0.14 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO YES NO NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15)
Terminal form J BEND J BEND THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location QUAD QUAD DUAL DUAL QUAD DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30 30
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - -
Humidity sensitivity level 1 1 1 1 1 - 1 - 1

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