EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD FREE, MO-153, TSSOP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 0.4 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDDR |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.4 mm |
| memory density | 2048 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Serial bus type | I2C |
| Maximum standby current | 0.000001 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) - annealed |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE/SOFTWARE |
| IS24C02D-2ZLI | IS24C02D-2PLI | IS24C02D-3ZLA3 | IS24C02D-2SLI | IS24C02D-2GLI | IS24C02D-3GLA3 | |
|---|---|---|---|---|---|---|
| Description | EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD FREE, MO-153, TSSOP-8 | EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD FREE, MO-153, TSSOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, 0.120 INCH, LEAD FREE, PLASTIC, MO-187, MSOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | TSSOP | DIP | TSSOP | TSSOP | SOIC | SOIC |
| package instruction | TSSOP, TSSOP8,.25 | DIP, DIP8,.3 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| Data retention time - minimum | 100 | 100 | 100 | 100 | 100 | 100 |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 |
| length | 4.4 mm | 9.325 mm | 4.4 mm | 3 mm | 4.9 mm | 4.9 mm |
| memory density | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | 1 | 3 | 1 | 1 | 3 | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 | 256 | 256 | 256 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | DIP | TSSOP | TSSOP | SOP | SOP |
| Encapsulate equivalent code | TSSOP8,.25 | DIP8,.3 | TSSOP8,.25 | TSSOP8,.19 | SOP8,.25 | SOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 2/5 V | 2/5 V | 3/5 V | 2/5 V | 2/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 4.57 mm | 1.2 mm | 1.1 mm | 1.73 mm | 1.73 mm |
| Serial bus type | I2C | I2C | I2C | I2C | I2C | I2C |
| Maximum standby current | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
| Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V | 1.8 V | 2.5 V | 1.8 V | 1.8 V | 2.5 V |
| Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 5 V | 2.5 V | 2.5 V | 5 V |
| surface mount | YES | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| Terminal surface | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 10 | 40 | 10 | 40 | 40 |
| width | 3 mm | 7.62 mm | 3 mm | 3 mm | 3.9 mm | 3.9 mm |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 10 ms | 5 ms | 5 ms | 10 ms |
| write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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