DATASHEET
Board Level Cooling – High Power Extruded 6380
BOARD LEVEL COOLING ‐ High Power Extruded 6380
High Power Extruded 6380 is a board level heat sink designed to cool TO‐218,
TO‐220, TO‐220‐single gauge, and SIP devices. Representative image only.
ORDERING INFORMATION
Part Number
6380BG
Device Type
TO‐218, TO‐220, TO‐220‐single gauge, SIP
HEAT SINK DETAILS
Property
Material
Finish
Device Attachment Options
Thermal Interface Material
Details
Aluminum
Black Anodize
Requires Mounting Kit
‐
Property
Heat Sink Width (mm)
Heat Sink Length (mm)
Heat Sink Height (mm)
Heat Sink Mounting Direction
Details
41.91
25.4
25.4
Vertical
MECHANICAL & PERFORMANCE
Drawing dimensions are shown in mm, (in)
“X” Dim
15.88 (0.625)
Part Number
6380BG
“A” Dim
25.4 (1.00)
“Y” Dim
2.64 (0.104)
“Z” Dim
2.67 (0.105)
Mounting Details:
USA: 1.855.322.2843
EUROPE: 39.051.764002
ASIA: 86.21.6115.2000 x8122
Board Level Cooling
www.aavid.com