|
LM3S2410-IBZ25-A2 |
LM3S2410-IBZ25-A2T |
LM3S2410-IQC25-A2 |
LM3S2410-IQC25-A2T |
Description |
Stellaris LM3S Microcontroller 108-NFBGA -40 to 85 |
Stellaris LM3S Microcontroller 108-NFBGA -40 to 85 |
Stellaris LM3S Microcontroller 100-LQFP -40 to 85 |
Stellaris LM3S Microcontroller 100-LQFP -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
BGA |
BGA |
QFP |
QFP |
package instruction |
BGA-108 |
BGA-108 |
LQFP-100 |
LQFP-100 |
Contacts |
108 |
108 |
100 |
100 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
Has ADC |
YES |
YES |
YES |
YES |
bit size |
32 |
32 |
32 |
32 |
maximum clock frequency |
0.032 MHz |
0.032 MHz |
0.032 MHz |
0.032 MHz |
DAC channel |
NO |
NO |
NO |
NO |
DMA channel |
NO |
NO |
NO |
NO |
JESD-30 code |
S-PBGA-B108 |
S-PBGA-B108 |
S-PQFP-G100 |
S-PQFP-G100 |
JESD-609 code |
e1 |
e1 |
e3 |
e3 |
length |
10 mm |
10 mm |
14 mm |
14 mm |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
Number of I/O lines |
60 |
60 |
60 |
60 |
Number of terminals |
108 |
108 |
100 |
100 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
PWM channel |
YES |
YES |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFBGA |
LFBGA |
LFQFP |
LFQFP |
Encapsulate equivalent code |
BGA108,12X12,32 |
BGA108,12X12,32 |
QFP100,.63SQ,20 |
QFP100,.63SQ,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
FLATPACK |
FLATPACK |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
power supply |
2.5,3.3 V |
2.5,3.3 V |
2.5,3.3 V |
2.5,3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM (bytes) |
32768 |
32768 |
32768 |
32768 |
rom(word) |
98304 |
98304 |
98304 |
98304 |
ROM programmability |
FLASH |
FLASH |
FLASH |
FLASH |
Maximum seat height |
1.5 mm |
1.5 mm |
1.6 mm |
1.6 mm |
speed |
25 MHz |
25 MHz |
25 MHz |
25 MHz |
Maximum supply voltage |
2.75 V |
2.75 V |
2.75 V |
2.75 V |
Minimum supply voltage |
2.25 V |
2.25 V |
2.25 V |
2.25 V |
Nominal supply voltage |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN |
TIN |
Terminal form |
BALL |
BALL |
GULL WING |
GULL WING |
Terminal pitch |
0.8 mm |
0.8 mm |
0.5 mm |
0.5 mm |
Terminal location |
BOTTOM |
BOTTOM |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10 mm |
10 mm |
14 mm |
14 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
Base Number Matches |
1 |
1 |
1 |
1 |
Factory Lead Time |
26 weeks |
- |
19 weeks |
16 weeks |