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MT4LSDT164GHG-166XX

Description
Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144
Categorystorage    storage   
File Size191KB,18 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric Compare View All

MT4LSDT164GHG-166XX Overview

Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144

MT4LSDT164GHG-166XX Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeMODULE
package instruction,
Contacts144
Reach Compliance Codeunknown
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time5.5 ns
JESD-30 codeR-XDMA-N144
memory density67108864 bit
Memory IC TypeSYNCHRONOUS GRAPHICS RAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals144
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX64
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationDUAL
ADVANCE
1, 2 MEG x 64
SDRAM GRAPHICS SODIMM
SMALL-OUTLINE
SDRAM MODULE
FEATURES
• Graphics application,144-pin, small-outline, dual in-
line memory module (SODIMM)
• Utilizes 143 MHz and 166 MHz SDRAM components
• Unbuffered
• 8MB (1 Meg x 64), 16MB (2 Meg x 64)
• Single +3.3V
±0.3V
power supply
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can be
changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8 or full page
• Auto Precharge and Auto Refresh Modes
• Self Refresh and Adaptable Auto Refresh Modes
- 32ms, 2,048-cycle refresh or
- 64ms, 4,096-cycle refresh
• LVTTL-compatible inputs and outputs
• Serial presence-detect (SPD)
MT4LSDT164GH, MT2LSDT264GH
For the latest data sheet revisions, please refer to the Micron
Web site:
www.micron.com/mti/msp/html/datasheet.html
PIN ASSIGNMENT (Front View)
144-Pin Small-Outline DIMM (8MB)
OPTIONS
• Package
144-pin SODIMM (gold)
MARKING
G
• Frequency/CAS Latency
166 MHz/CL = 3 (6ns, 166 MHz SDRAMs) -166
143 MHz/CL = 3 (7ns, 143 MHz SDRAMs) -143
KEY SDRAM COMPONENT
TIMING PARAMETERS
MODULE
MARKING
-166
-143
CLOCK
FREQUENCY
166 MHz
143 MHz
SPEED
GRADE
-6
-7
ACCESS
TIME
5.5ns
5.5ns
SETUP
TIME
2ns
2ns
HOLD
TIME
1ns
1ns
PART NUMBERS
PART NUMBER
MT4LSDT164GHG-166__
MT4LSDT164GHG-143__
MT2LSDT264GHG-166__
MT2LSDT264GHG-143__
CONFIGURATION
1 Meg x 64
1 Meg x 64
2 Meg x 64
2 Meg x 64
VERSION
166 MHz, CL = 3
143 MHz, CL = 3
166 MHz, CL = 3
143 MHz, CL = 3
PIN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
FRONT
V
SS
DQ63
DQ61
DQ59
DQ57
V
DD
DQ55
DQ53
DQ51
DQ49
V
SS
DQMB7
DQMB5
V
DD
DQ47
DQ45
DQ43
DQ41
V
SS
DQ39
DQ37
DQ35
DQ33
V
DD
RFU
RFU
RFU
V
SS
NC
RFU
RFU
V
DD
NC
RAS#
WE#
V
SS
PIN
BACK
PIN
FRONT
2
V
SS
73 CK1 (NC**)
4
DQ62
75
V
DD
6
DQ60
77
RFU
8
DQ58
79
A9*
10
DQ56
81
A11/BA0*
12
V
DD
83
A7
14
DQ54
85
V
SS
16
DQ52
87
A5
18
DQ50
89
A3
20
DQ48
91
A1
22
V
SS
93
V
DD
24
DQMB6
95
DQ31
26
DQMB4
97
DQ29
28
V
DD
99
DQ27
30
DQ46
101
DQ25
32
DQ44
103
V
SS
34
DQ42
105
DQ23
36
DQ40
107
DQ21
38
V
SS
109
DQ19
40
DQ38
111
DQ17
42
DQ36
113
V
DD
44
DQ34
115
DQMB3
46
DQ32
117
DQMB1
48
V
DD
119
V
SS
50
RFU
121
DQ15
52
RFU
123
DQ13
54 RFU(BA1**) 125
DQ11
56
V
SS
127
DQ9
58
RFU
129
V
DD
60
RFU
131
DQ7
62
SA0
133
DQ5
64
V
DD
135
DQ3
66
S0#
137
DQ1
68
CAS#
139
V
SS
70
CKE0
141
SDA
72
V
SS
143
V
DD
PIN
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
134
136
138
140
142
144
BACK
CK0
V
DD
RFU
A8*
A10/AP*
A6
V
SS
A4
A2
A0
V
DD
DQ30
DQ28
DQ26
DQ24
V
SS
DQ22
DQ20
DQ18
DQ16
V
DD
DQMB2
DQMB0
V
SS
DQ14
DQ12
DQ10
DQ8
V
DD
DQ6
DQ4
DQ2
DQ0
V
SS
SCL
V
DD
NOTE:
All part numbers end with a two-place code (not shown),
designating component and PCB revisions. Consult
factory for current revision codes. Example:
MT4LSDT164GHG-166C1.
1, 2 Meg x 64 SDRAM Graphics SODIMM
ZM31.p65 – Rev. 6/99
*
Refer to Table 1 on the following page for comparison to SGRAM-based
modules.
** 16MB version only.
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©1999,
Micron Technology, Inc.
Micron is a registered trademark of Micron Technology, Inc.

MT4LSDT164GHG-166XX Related Products

MT4LSDT164GHG-166XX MT2LSDT264GHG-166XX MT4LSDT164GHG-143XX MT2LSDT264GHG-143XX
Description Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144 Synchronous Graphics RAM Module, 2MX64, 5.5ns, CMOS, SODIMM-144 Synchronous Graphics RAM Module, 1MX64, 5.5ns, CMOS, SODIMM-144 Synchronous Graphics RAM Module, 2MX64, 5.5ns, CMOS, SODIMM-144
Maker Micron Technology Micron Technology Micron Technology Micron Technology
Parts packaging code MODULE MODULE MODULE MODULE
Contacts 144 144 144 144
Reach Compliance Code unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99
access mode DUAL BANK PAGE BURST FOUR BANK PAGE BURST DUAL BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 5.5 ns 5.5 ns 5.5 ns 5.5 ns
JESD-30 code R-XDMA-N144 R-XDMA-N144 R-XDMA-N144 R-XDMA-N144
memory density 67108864 bit 134217728 bit 67108864 bit 134217728 bi
Memory IC Type SYNCHRONOUS GRAPHICS RAM MODULE SYNCHRONOUS GRAPHICS RAM MODULE SYNCHRONOUS GRAPHICS RAM MODULE SYNCHRONOUS GRAPHICS RAM MODULE
memory width 64 64 64 64
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 144 144 144 144
word count 1048576 words 2097152 words 1048576 words 2097152 words
character code 1000000 2000000 1000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 1MX64 2MX64 1MX64 2MX64
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL DUAL
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