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IS62LV1288BLL-70HI

Description
Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, STSOP1-32
Categorystorage    storage   
File Size47KB,10 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric Compare View All

IS62LV1288BLL-70HI Overview

Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, STSOP1-32

IS62LV1288BLL-70HI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP1
package instructionSTSOP1-32
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length11.8 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP32,.56,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000015 A
Minimum standby current2 V
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm

IS62LV1288BLL-70HI Preview

IS62LV1288BLL
128K x 8 LOW POWER and LOW Vcc
CMOS STATIC RAM
FEATURES
• Access times of 70 ns
Low active power: 60 mW (typical)
Low standby power: 6 µW (typical) CMOS
standby
• Low data retention voltage: 2V (min.)
• Ultra Low Power
• Output Enable (OE) and two Chip Enable
(CE1 and CE2) inputs for ease in applications
• TTL compatible inputs and outputs
• Single 3.0V (min.) to 3.6V (max.) power supply
• Industrial temperature available
• Available in 32-pin TSOP (Type I), 32-pin
STSOP, and 450-mil SOP
ISSI
DESCRIPTION
®
AUGUST 2002
The
ISSI
IS62LV1288BLL is a low power and low
Vcc,131,072-word by 8-bit CMOS static RAM. It is
fabricated using
ISSI
's high-performance CMOS
technology. This highly reliable process coupled with
innovative circuit design techniques, yields higher
performance and low power consumption devices.
When
CE1
is HIGH or CE2 is LOW (deselected), the
device assumes a standby mode at which the power
dissipation can be reduced by using CMOS input levels.
Easy memory expansion is provided by using two Chip
Enable inputs,
CE1
and CE2. The active LOW Write Enable
(WE) controls both writing and reading of the memory.
The IS62LV1288LL is available in 32-pin TSOP (Type I),
STSOP (8 x 13.4mm), and 450-mil plastic SOP (525-mil
pin to pin) packages.
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
512 X 2048
MEMORY ARRAY
VCC
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE1
CE2
OE
WE
CONTROL
CIRCUIT
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI
assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device
specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
08/10/02
1
IS62LV1288BLL
PIN CONFIGURATION
32-Pin SOP (Q)
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
A15
CE2
WE
A13
A8
A9
A11
OE
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
ISSI
PIN CONFIGURATION
32-Pin TSOP (Type I) (T) and STSOP (Type 1) (H)
A11
A9
A8
A13
WE
CE2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
®
PIN DESCRIPTIONS
A0-A16
CE1
CE2
OE
WE
I/O0-I/O7
NC
Vcc
GND
Address Inputs
Chip Enable 1 Input
Chip Enable 2 Input
Output Enable Input
Write Enable Input
Input/Output
No Connection
Power
Ground
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
08/10/02
IS62LV1288BLL
TRUTH TABLE
Mode
Not Selected
(Power-down)
Output Disabled
Read
Write
WE
X
X
H
H
L
CE1
H
X
L
L
L
CE2
X
L
H
H
H
OE
X
X
H
L
X
I/O Operation
High-Z
High-Z
High-Z
D
OUT
D
IN
Vcc Current
I
SB
1
, I
SB
2
I
SB
1
, I
SB
2
I
CC
I
CC
I
CC
ISSI
®
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
V
CC
T
STG
P
T
Parameter
Terminal Voltage with Respect to GND
Vcc related to GND
Storage Temperature
Power Dissipation
Value
–0.3 to + 4.6
–0.3 to + 4.6
–65 to +125
1.0
Unit
V
V
°C
W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
OPERATING RANGE
Range
Industrial
Ambient Temperature
–40°C to +85°C
Speed
-70 ns
V
CC
M
IN
.
3.0V
V
CC
M
AX
.
3.6V
DC ELECTRICAL CHARACTERISTICS
(Over Operating Range)
Symbol
V
OH
V
OL
V
IH
V
IL
I
LI
I
LO
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
(1)
Input Leakage
Output Leakage
Test Conditions
V
CC
= Min., I
OH
= –1.0 mA
V
CC
= Min., I
OL
= 2.1 mA
Min.
2.2
2.2
–0.3
–1
–1
Max.
0.4
V
CC
+ 0.3
0.6
1
1
Unit
V
V
V
V
µA
µA
GND
V
IN
V
CC
GND
V
OUT
V
CC
Notes:
1. V
IL
= –1.5V for pulse width less than 30 ns and not 100% tested.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
08/05/02
3
IS62LV1288BLL
POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
Symbol Parameter
I
CC
I
SB
1
Test Conditions
Ind.
Ind.
-70
Min. Max.
30
1
Unit
mA
mA
ISSI
®
Vcc Dynamic Operating V
CC
= Max.,
CE
= V
IL
Supply Current
I
OUT
= 0 mA, f = f
MAX
TTL Standby Current
(TTL Inputs)
CMOS Standby
Current (CMOS Inputs)
V
CC
= Max.,
V
IN
= V
IH
or V
IL
,
CE1
V
IH
or CE2
V
IL
, f = 0
I
SB
2
V
CC
= Max., f = 0
Ind.
CE1
V
CC
– 0.2V,
typ
(2)
CE2
0.2V,
or V
IN
V
CC
– 0.2V, V
IN
0.2V
15
2
µA
Note:
1. At f = f
MAX
, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at Vcc = 3.3V, T
A
= 25
o
C and not 100% tested.
CAPACITANCE
(1,2)
Symbol
C
IN
C
OUT
Parameter
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
6
8
Unit
pF
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A
= 25°C, f = 1 MHz, Vcc = 3.0V.
4
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
08/10/02
IS62LV1288BLL
READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
-70
Symbol
Parameter
Read Cycle Time
Address Access Time
Output Hold Time
CE1
Access Time
CE2 Access Time
OE
Access Time
OE
to Low-Z Output
OE
to High-Z Output
CE1
to Low-Z Output
CE2 to Low-Z Output
CE1
or CE2 to High-Z Output
Min.
70
10
5
0
10
10
0
Max.
70
70
70
35
25
25
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ISSI
®
t
RC
t
AA
t
OHA
t
ACE
1
t
ACE
2
t
DOE
t
LZOE
(2)
t
HZOE
(2)
t
LZCE
1
(2)
t
LZCE
2
(2)
t
HZCE
(2)
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0.4V to 2.2V
and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0.4V to 2.2V
5 ns
1.5V
See Figures 1 and 2
AC TEST LOADS
1213
3.0V
1213
3.0V
OUTPUT
100 pF
Including
jig and
scope
1378
OUTPUT
5 pF
Including
jig and
scope
1378
Figure 1.
Figure 2.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
08/05/02
5

IS62LV1288BLL-70HI Related Products

IS62LV1288BLL-70HI IS62LV1288BLL-70QI IS62LV1288BLL-70TI
Description Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, STSOP1-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, TSOP1-32
Is it Rohs certified? incompatible incompatible incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code TSOP1 SOIC TSOP1
package instruction STSOP1-32 0.450 INCH, PLASTIC, SOP-32 TSOP1-32
Contacts 32 32 32
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Maximum access time 70 ns 70 ns 70 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
JESD-609 code e0 e0 e0
length 11.8 mm 20.4285 mm 18.4 mm
memory density 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 32 32 32
word count 131072 words 131072 words 131072 words
character code 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
organize 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 SOP TSOP1
Encapsulate equivalent code TSSOP32,.56,20 SOP32,.45 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 3 mm 1.2 mm
Maximum standby current 0.000015 A 0.000015 A 0.000015 A
Minimum standby current 2 V 2 V 2 V
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 1.27 mm 0.5 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8 mm 11.303 mm 8 mm
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