7025L55PFI datasheet, PDF - EEWORLD Datasheet

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7025L55PFI: DescriptionApplication Specific SRAM, 8KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100; Categorystorage storage; File Size183KB，22 Pages; ManufacturerIDT (Integrated Device Technology)

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7025L55PFI Overview

Application Specific SRAM, 8KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

7025L55PFI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
package instruction	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
memory density	131072 bit
Memory IC Type	APPLICATION SPECIFIC SRAM
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	100
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.004 A
Minimum standby current	2 V
Maximum slew rate	0.25 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20

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	7025L55PFI	7025S20PFI	7025L17PFI	7025L25PFI	7025S55PFI	7025L55JI
Description	Application Specific SRAM, 8KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Dual-Port SRAM, 8KX16, 20ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 8KX16, 17ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Multi-Port SRAM, 8KX16, 20ns, CMOS, PQFP100	Dual-Port SRAM, 8KX16, 55ns, CMOS, PQFP100, TQFP-100	Application Specific SRAM, 8KX16, 55ns, CMOS, PQCC84, 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Reach Compliance Code	not_compliant	not_compliant	unknown	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	20 ns	17 ns	20 ns	55 ns	55 ns
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQCC-J84
memory density	131072 bit	131072 bit	131072 bit	131072 bit	131072 bit	131072 bit
Memory IC Type	APPLICATION SPECIFIC SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM	DUAL-PORT SRAM	APPLICATION SPECIFIC SRAM
memory width	16	16	16	16	16	16
Number of terminals	100	100	100	100	100	84
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	8KX16	8KX16	8KX16	8KX16	8KX16	8KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	LFQFP	LFQFP	QFP	LFQFP	QCCJ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	J BEND
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Is it lead-free?	Contains lead	Contains lead	-	-	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible
package instruction	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	TQFP-100	LFQFP,	-	TQFP-100	1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84
I/O type	COMMON	COMMON	-	COMMON	COMMON	COMMON
JESD-609 code	e0	e0	-	e0	e0	e0
Humidity sensitivity level	3	3	-	3	3	1
Number of functions	1	1	1	-	1	1
Number of ports	2	2	-	2	2	2
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	-	QFP100,.63SQ,20	QFP100,.63SQ,20	LDCC84,1.2SQ
Peak Reflow Temperature (Celsius)	240	240	-	-	240	225
power supply	5 V	5 V	-	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.004 A	0.03 A	-	0.004 A	0.03 A	0.004 A
Minimum standby current	2 V	4.5 V	-	2 V	4.5 V	2 V
Maximum slew rate	0.25 mA	0.37 mA	-	0.37 mA	0.3 mA	0.25 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	-	4.5 V	4.5 V
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	-	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Maximum time at peak reflow temperature	20	20	-	-	20	30
Base Number Matches	-	1	1	1	1	-

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