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7025S55PFI

Description
Dual-Port SRAM, 8KX16, 55ns, CMOS, PQFP100, TQFP-100
Categorystorage    storage   
File Size183KB,22 Pages
ManufacturerIDT (Integrated Device Technology)
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7025S55PFI Overview

Dual-Port SRAM, 8KX16, 55ns, CMOS, PQFP100, TQFP-100

7025S55PFI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionTQFP-100
Contacts100
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeS-PQFP-G100
JESD-609 codee0
length14 mm
memory density131072 bit
Memory IC TypeDUAL-PORT SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of ports2
Number of terminals100
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP100,.63SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.03 A
Minimum standby current4.5 V
Maximum slew rate0.3 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
Base Number Matches1

7025S55PFI Related Products

7025S55PFI 7025S20PFI 7025L17PFI 7025L25PFI 7025L55JI 7025L55PFI
Description Dual-Port SRAM, 8KX16, 55ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 8KX16, 20ns, CMOS, PQFP100, TQFP-100 Dual-Port SRAM, 8KX16, 17ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Multi-Port SRAM, 8KX16, 20ns, CMOS, PQFP100 Application Specific SRAM, 8KX16, 55ns, CMOS, PQCC84, 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84 Application Specific SRAM, 8KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code not_compliant not_compliant unknown not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 55 ns 20 ns 17 ns 20 ns 55 ns 55 ns
JESD-30 code S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQCC-J84 S-PQFP-G100
memory density 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit 131072 bit
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM MULTI-PORT SRAM APPLICATION SPECIFIC SRAM APPLICATION SPECIFIC SRAM
memory width 16 16 16 16 16 16
Number of terminals 100 100 100 100 84 100
word count 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 8KX16 8KX16 8KX16 8KX16 8KX16 8KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP QFP QCCJ QFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK CHIP CARRIER FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING J BEND GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 1.27 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Is it lead-free? Contains lead Contains lead - - Contains lead Contains lead
Is it Rohs certified? incompatible incompatible - incompatible incompatible incompatible
package instruction TQFP-100 TQFP-100 LFQFP, - 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
I/O type COMMON COMMON - COMMON COMMON COMMON
JESD-609 code e0 e0 - e0 e0 e0
Humidity sensitivity level 3 3 - 3 1 3
Number of functions 1 1 1 - 1 1
Number of ports 2 2 - 2 2 2
Output characteristics 3-STATE 3-STATE - 3-STATE 3-STATE 3-STATE
Encapsulate equivalent code QFP100,.63SQ,20 QFP100,.63SQ,20 - QFP100,.63SQ,20 LDCC84,1.2SQ QFP100,.63SQ,20
Peak Reflow Temperature (Celsius) 240 240 - - 225 240
power supply 5 V 5 V - 5 V 5 V 5 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum standby current 0.03 A 0.03 A - 0.004 A 0.004 A 0.004 A
Minimum standby current 4.5 V 4.5 V - 2 V 2 V 2 V
Maximum slew rate 0.3 mA 0.37 mA - 0.37 mA 0.25 mA 0.25 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) - Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Maximum time at peak reflow temperature 20 20 - - 30 20
Base Number Matches 1 1 1 1 - -
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