PLX464-35 datasheet, PDF - EEWORLD Datasheet

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PLX464-35: DescriptionProgrammable Logic Device, PAL-Type, CMOS, CDIP24; CategoryProgrammable logic devices Programmable logic; File Size353KB，8 Pages; ManufacturerPLX Technology, Inc. (Broadcom )

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PLX464-35 Overview

Programmable Logic Device, PAL-Type, CMOS, CDIP24

PLX464-35 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	PLX Technology, Inc. (Broadcom )
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
Architecture	PAL-TYPE
maximum clock frequency	18 MHz
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Number of entries	26
Output times	8
Number of product terms	88
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

PLX464-35 Related Products

	PLX464-35	PLX464D-45	PLX464P-45	PLX464-25	PLX464-45
Description	Programmable Logic Device, PAL-Type, CMOS, CDIP24	UV PLD, 45ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24	OT PLD, 45ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	Programmable Logic Device, PAL-Type, CMOS, CDIP24	Programmable Logic Device, PAL-Type, CMOS, CDIP24
Maker	PLX Technology, Inc. (Broadcom )	PLX Technology, Inc. (Broadcom )	PLX Technology, Inc. (Broadcom )	PLX Technology, Inc. (Broadcom )	PLX Technology, Inc. (Broadcom )
package instruction	DIP, DIP24,.3	WDIP,	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
maximum clock frequency	18 MHz	16.7 MHz	16.7 MHz	28.5 MHz	15 MHz
JESD-30 code	R-XDIP-T24	R-GDIP-T24	R-PDIP-T24	R-XDIP-T24	R-XDIP-T24
Number of terminals	24	24	24	24	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	WDIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE, WINDOW	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible
Architecture	PAL-TYPE	-	PAL-TYPE	PAL-TYPE	PAL-TYPE
JESD-609 code	e0	-	e0	e0	e0
Number of entries	26	-	26	26	26
Output times	8	-	8	8	8
Number of product terms	88	-	88	88	88
Encapsulate equivalent code	DIP24,.3	-	DIP24,.3	DIP24,.3	DIP24,.3
power supply	5 V	-	5 V	5 V	5 V
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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