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MC145574AEG

Description
DATACOM, DIGITAL SLIC, PDSO28, 0.600 INCH, PLASTIC, SOIC-28
CategoryWireless rf/communication    Telecom circuit   
File Size694KB,167 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MC145574AEG Overview

DATACOM, DIGITAL SLIC, PDSO28, 0.600 INCH, PLASTIC, SOIC-28

MC145574AEG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instructionSOP,
Contacts28
Reach Compliance Codecompliant
ECCN code5A991
JESD-30 codeR-PDSO-G28
JESD-609 codee3
length17.925 mm
Humidity sensitivity level3
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height2.65 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesDIGITAL SLIC
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width7.5 mm
MC145574/D
REV 6
MC145574
ISDN S/T-Interface Transceiver
Coming through loud and clear.
m

MC145574AEG Related Products

MC145574AEG MC145574AAC MC145574AEGR2 MC145574AACR2
Description DATACOM, DIGITAL SLIC, PDSO28, 0.600 INCH, PLASTIC, SOIC-28 DATACOM, DIGITAL SLIC, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, TQFP-32 DATACOM, DIGITAL SLIC, PDSO28, 0.600 INCH, PLASTIC, SOIC-28 DATACOM, DIGITAL SLIC, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, TQFP-32
Is it Rohs certified? conform to conform to conform to conform to
Maker NXP NXP NXP NXP
Parts packaging code SOIC QFP SOIC QFP
package instruction SOP, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, TQFP-32 SOP, LQFP,
Contacts 28 32 28 32
Reach Compliance Code compliant unknown compliant compliant
ECCN code 5A991 EAR99 5A991 EAR99
JESD-30 code R-PDSO-G28 S-PQFP-G32 R-PDSO-G28 S-PQFP-G32
JESD-609 code e3 e3 e3 e3
length 17.925 mm 7 mm 17.925 mm 7 mm
Humidity sensitivity level 3 3 3 3
Number of functions 1 1 1 1
Number of terminals 28 32 28 32
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP LQFP SOP LQFP
Package shape RECTANGULAR SQUARE RECTANGULAR SQUARE
Package form SMALL OUTLINE FLATPACK, LOW PROFILE SMALL OUTLINE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 1.6 mm 2.65 mm 1.6 mm
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
Telecom integrated circuit types DIGITAL SLIC DIGITAL SLIC DIGITAL SLIC DIGITAL SLIC
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) TIN Matte Tin (Sn) TIN
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 0.8 mm 1.27 mm 0.8 mm
Terminal location DUAL QUAD DUAL QUAD
Maximum time at peak reflow temperature 40 40 40 40
width 7.5 mm 7 mm 7.5 mm 7 mm
Base Number Matches - 1 1 1

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