GS8170EW36C-333 datasheet, PDF

GS8170EW36C-333: DescriptionStandard SRAM, 512KX36, 5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209; Categorystorage storage; File Size938KB，39 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS8170EW36C-333 Overview

Standard SRAM, 512KX36, 5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA,
Contacts	209
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	5 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B209
length	22 mm
memory density	18874368 bit
Memory IC Type	STANDARD SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	209
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.7 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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